Pick-and-place device for microseismic sensor with strain gauge sticking structure and method of use thereof

A technology of microseismic sensor and pick-and-place device, which is applied to measurement devices, seismic signal receivers, instruments, etc., can solve the problems of unrecoverable sensors, failure to monitor hole wall strain, and extended construction period.

Active Publication Date: 2021-05-25
HEFEI UNIV OF TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

This method has the following disadvantages: 1) The sensor is not recyclable, resulting in high economic costs; 2) After pouring, if the sensor is found to have no signal or the signal is not good, it cannot be checked; 3) It takes a long period for the cement slurry to solidify after pouring, which will lead to poor construction. The deadline is extended; 4) The installation process is time-consuming and laborious, requiring a series of professional grouting equipment and grouting personnel, requiring a lot of labor
[0005] At the same time, the existing installation method of microseismic sensor mainly considers placing the microseismic sensor at the predetermined depth of the hole to receive elastic wave and stress wave signals, and does not consider monitoring the strain of the hole wall.

Method used

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  • Pick-and-place device for microseismic sensor with strain gauge sticking structure and method of use thereof
  • Pick-and-place device for microseismic sensor with strain gauge sticking structure and method of use thereof
  • Pick-and-place device for microseismic sensor with strain gauge sticking structure and method of use thereof

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Embodiment Construction

[0049] The present invention will be further described below in conjunction with accompanying drawing:

[0050] Such as figure 1 , figure 2 , image 3 The shown pick-and-place device for microseismic sensors with a strain gauge pasting structure includes a support wall assembly with a hollow columnar structure as a whole. The support wall assembly is formed by combining two symmetrically arranged arc-shaped plates 1 with the same structure. Such as Figure 8 , Figure 9 As shown, the inner walls of the two arc-shaped plates 1 are respectively provided with square grooves 12 inwardly, and the groove walls on both sides of the groove 12 are symmetrically provided with slide bar grooves 13, and the grooves 12 are also provided with connecting two grooves. The fixed rod 14 of the side groove wall, the fixed rod 14 is arranged on the side close to the microseismic sensor 4, the setting direction of the groove 12 and the slide rod groove 13 coincides with the axial direction of...

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Abstract

The invention relates to a pick-and-place device for a microseismic sensor with a strain gauge sticking structure and a use method thereof. It includes a support wall assembly and a telescopic mechanism, which drives the two arc-shaped plates to retract inwardly or expand outwardly at the same time, and the telescopic mechanism includes a screw rod and is symmetrically fixed on both sides of the screw rod along the central axis of the screw rod The rhombus-shaped telescopic part, the said curved plate is provided with a strain gauge sticking assembly, one end of the said screw is connected with a microseismic sensor, the other end of said screw is connected with the inner guide rod through a connecting sleeve, and said inner guide The rod drives the screw to rotate, the inner guide rod is covered with an outer conduit, and one end of the outer conduit is provided with a bayonet structure. It can be seen from the above technical solution that the present invention can realize the placement and recovery of the microseismic sensor, which reduces the economic cost; at the same time, the strain gauge can also be attached to the inner wall of the hole to be monitored during the placement of the microseismic sensor, and then the hole to be monitored can be monitored. strain on the hole wall.

Description

technical field [0001] The invention relates to the field of engineering geological microseismic detection, in particular to a pick-and-place device for a microseismic sensor with a strain gauge pasting structure and a method for using the same. Background technique [0002] Disturbances generated during engineering construction often cause deformation and failure of rock mass. The destruction of these rock masses, especially dynamic disasters such as rock bursts and mine earthquakes, will directly endanger the safe construction of the project, cause losses to production, and pose a threat to personnel safety. Therefore, effective monitoring and prediction of rock mass stability and rockburst dynamic disasters is one of the important contents of engineering safety construction. Microseismic monitoring is an important means of monitoring and predicting rock mass stability and rockburst dynamic disasters in engineering construction. [0003] During engineering construction, ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G01V1/20G01V1/18
CPCG01V1/181G01V1/20
Inventor 汪亦显张辉贺文宇李娴林杭查正刚刘飞飞张伟郭盼盼汪志强
Owner HEFEI UNIV OF TECH
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