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A kind of diamond composite material and its preparation method and application

A technology of composite material and diamond, applied in the field of diamond composite material and its preparation

Active Publication Date: 2021-02-12
东莞市中微力合半导体科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The present invention solves the problem that the fine grinding of copper discs requires frequent slotting and deepening, and at the same time, it does not need to add diamond abrasive liquid, which reduces the amount of diamond abrasive grains and saves the cost of consumables

Method used

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  • A kind of diamond composite material and its preparation method and application
  • A kind of diamond composite material and its preparation method and application
  • A kind of diamond composite material and its preparation method and application

Examples

Experimental program
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Effect test

preparation example Construction

[0040] The present invention also provides a preparation method of the diamond composite material described in the above technical solution, comprising the following steps:

[0041] Mixing water and a water-based adhesive to obtain a water-based adhesive solution;

[0042] Mixing inorganic composite binder, diamond abrasive grains, talcum powder, polycarboxylate superplasticizer and glass fiber to obtain a premix;

[0043] mixing the aqueous adhesive solution and the premix to obtain a slurry;

[0044] mixing the slurry with the foam to obtain a foam diamond composite slurry;

[0045] The foamed diamond composite slurry is poured into the holes of the honeycomb core material and baked to obtain the diamond composite material.

[0046] The invention mixes water and water-based adhesive to obtain a water-based adhesive solution.

[0047] The invention mixes inorganic composite binder, diamond abrasive grain, talcum powder, polycarboxylate water reducer and glass fiber to obta...

Embodiment 1

[0056] Weigh each component by weight percentage: gypsum hemihydrate 37%, silica fume 2%, diamond abrasive grain 3%, talcum powder 15%, polyvinyl alcohol solution 5% (concentration is 5%), foam 16%, glass fiber 0.5%, polycarboxylate superplasticizer 0.3%, water 21.2%;

[0057] Wherein, the foam is prepared as follows: prepare foaming agent aqueous solution, wherein the animal and plant foaming agent concentration is 10%, and the ratio of polyvinyl alcohol aqueous solution is 3%, then the foaming agent solution is sent to the foaming machine, and the density is prepared 50kg / m 3 the foam;

[0058] The particle size of the above-mentioned diamond abrasive grains is 0.5 μm;

[0059] Add water and polyvinyl alcohol solution into the stirring tank; premix the solid components of hemihydrate gypsum, silica fume, diamond abrasive grains, talcum powder, glass fiber, and polycarboxylate superplasticizer, and then stir Add the premixed mixture gradually to the stirring tank under cer...

Embodiment 2～8

[0063] Embodiments 2-8 are comparative tests of 7 different formulations. These prescriptions are listed in Table 1 together with the prescription of embodiment 1, are all prepared by the processing step of embodiment 1.

[0064] Table 1. Diamond composite material weight percentage formula

[0065]

[0066]

[0067] The diamond composite material provided by the invention can be used for precise grinding of flat hard and brittle materials, and when the hard and brittle materials are flat-machined, the hard and brittle materials are flat-pressed on a diamond flat plate and then ground with water. Such as figure 2 As shown, 200-water-soluble gypsum foam containing diamond abrasive grains; 201-air bubbles; 202-gypsum wall containing diamond abrasive grains; 203-diamond abrasive grains. Diamond composite foam abrasive blocks are composed of a large number of air bubbles, binders and diamond abrasive grains. When the diamond composite foam abrasive block will slightly di...

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Abstract

The invention provides a diamond composite material, which relates to the field of fine grinding of hard and brittle materials. In the present invention, when the diamond composite material is used for fine grinding, it will slightly dissolve after it comes into contact with pure water. At this time, the diamond abrasive grains will be released and form a grinding liquid with water. The honeycomb core material has a certain mechanical support force. When grinding, the abrasive liquid will climb to the top surface of the core material wall to interact with the processed sample. At the same time, the slightly soluble abrasive block will produce slight depressions, and the large particles produced by grinding will roll down into these depressions to avoid scratches. sample. In this structure, the loss of water-soluble gypsum foam is synchronized with the wear rate of the honeycomb core material, which avoids frequent slotting like copper discs, and does not need to add additional diamond abrasive fluid, which improves the utilization of diamond abrasive grains efficiency.

Description

technical field [0001] The invention relates to the technical field of fine grinding of hard and brittle materials, in particular to a diamond composite material and its preparation method and application. Background technique [0002] Ultra-hard materials such as zirconia ceramics and artificial sapphire have considerable potential for application in smartphones, such as fingerprint identification sheets, ceramic back covers, lens protection sheets, etc. The production of hard material products lies in the fine grinding and polishing of the surface of the material to make it have a bright surface. [0003] The surface polishing of hard materials needs to go through three stages of rough grinding, fine grinding and polishing. On the flat copper plate, the processed surface of the sample is pressed on the copper plate for processing. Due to the good ductility of metal copper, some diamond abrasive particles will be embedded on the surface of the copper disk under the pressu...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B24B37/12B24D18/00B24D3/02C04B28/14C04B111/40
CPCB24B37/12B24D3/02B24D18/009C04B28/14C04B2111/00362C04B2111/00482C04B2111/40C04B18/146C04B14/022C04B14/042C04B14/42C04B24/14C04B24/2623C04B38/106C04B2103/302B24B37/14B24D18/00
Inventor 朱联烽田多胜邓宏念
Owner 东莞市中微力合半导体科技有限公司
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