Diode packaging structure with good conductivity
A technology of electrical conductivity and packaging structure, which is applied in the direction of circuits, electrical components, semiconductor devices, etc., can solve the problems such as the decline of the conductivity of diodes, and achieve the effect of stably fixing pins, good electrical conductivity, and enhancing the electrical conductivity of pins
Active Publication Date: 2020-01-14
山东浮来春生物化工有限公司
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Problems solved by technology
[0005] Aiming at the deficiencies of the prior art, the present invention provides a diode packaging structure with good electrical conductivity, which has the advantages of good electrical conductivity and reduced use of welded parts, and solves the problem of diode conduction due to the use of welded parts of different materials in the prior art. The problem of slow performance
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[0025] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.
[0026] see Figure 1-5 , a diode packaging structure with good electrical conductivity, comprising an outer packaging cover 1, an inner packaging cover 2 is fixedly installed inside the outer packaging cover 1, and the inner packaging cover 2 is fixedly installed on the top of the first electrode 5 and the second electrode 6, The inner packaging cover 2 protects the diode chip 3 from being corroded or oxidized by air, and prolongs its life. The inner packaging...
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The invention relates to the technical field of diode packaging, and discloses a diode packaging structure with good conductivity. The diode packaging structure with good conductivity comprises an outer package cover, an inner packaging cover is fixedly mounted in the outer package, a diode chip is fixedly mounted in the inner package cover, the left side of the diode chip is connected with a first electrode through a metal wire, the right side of the diode chip is connected with a second electrode through a metal wire, connecting grooves are formed in the end faces, away from each other, of the first electrode and the second electrode, limiting holes are formed in the upper inner walls and the lower inner walls of the connecting grooves, and the left side of the first electrode and the right side of the second electrode are movably connected with fixing devices composed of connecting blocks. According to the device, the first clamping block on the first electrode is fixed to the leftside of the bottom of the packaging device by the first insulator and the bearing block, the second clamping block on the second electrode is fixed to the right side of the bottom of the packaging device by the second insulator and the bearing block, the electrodes are fixed through the structure, and the conductivity of the pins is enhanced.
Description
technical field [0001] The invention relates to the technical field of diode packaging, in particular to a diode packaging structure with good electrical conductivity. Background technique [0002] Diode packaging refers to connecting the circuit pins on the silicon chip to the external joints with wires so as to connect with other devices. It also has the functions of installing, sealing, and protecting the chip in structure. The chip is isolated from the outside world. Prevent the air from oxidizing and corroding the chip circuit, resulting in performance damage. On the other hand, the packaged chip is also convenient for transportation and later user installation. [0003] Common diode packaging structures include packaging layers, insulating bases, electrodes, and light-emitting chips. In the prior art, materials of different materials are used to connect electrodes, insulating bases, and packaging layers, which not only leads to a decrease in the conductivity of the dio...
Claims
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IPC IPC(8): H01L33/48H01L33/62
CPCH01L33/48H01L33/62
Inventor 李娜姜海涛陈哲斌
Owner 山东浮来春生物化工有限公司