Open electrocardiogram sensor packaging technology

Abstract

The invention discloses an open electrocardiogram sensor packaging technology. The open electrocardiogram sensor packaging technology comprises a film pasting and cutting process, a frame pasting process, a photosensitive chip pasting process, a first curing process, a light-emitting chip pasting process, a second curing process and a bonding wire process. According to the film pasting and cuttingprocess, a substrate is pasted on a circular ring to which a UV film is attached; the substrate is cut into a base with a specified size along a preset cutting channel; the base is transferred to a film pasting carrier. According to the photosensitive chip pasting process, a plurality of photosensitive chips are pasted on the base. According to the first curing process, curing treatment is performed on the base which has been subjected to the photosensitive chip pasting process. According to the light-emitting chip pasting process, light-emitting chips are pasted on the base which has been subjected to the first curing process. According to the second curing process, curing treatment is performed on the base which has been subjected to the light-emitting chip pasting process. According tothe bonding wire process, the photosensitive chips and the light-emitting chips are in electrically conductive connection with the base through bonding wires. With the open type electrocardiogram sensor packaging process adopted, the light-emitting chips and the light-sensitive chips can be firmly bonded with the substrate and are not prone to falling off; the bonding wires are not prone to bending; and the yield of the technology is high.

Description

technical field [0001] The invention relates to the technical field of packaging of electronic devices, in particular to an open electrocardiogram sensor packaging process. Background technique [0002] The electrocardiogram sensor is a sensor that can sense the action potential waveform of cells in different regions of the heart and convert it into a usable output signal. The packaging process is roughly as follows: [0003] 1. Marking; use laser to print dot matrix content on the back of the substrate, which can play a traceability role; [0004] 2. Paste the first photosensitive chip: Paste the first photosensitive chip on the substrate, [0005] 3. Curing for the first time: heating the substrate on which the first photosensitive chip is pasted, so that the bonding glue of the first photosensitive chip is cured; [0006] 4. Pasting of the second photosensitive chip: bonding the second photosensitive chip on the first cured substrate; [0007] 5. Second curing: heating...

AI Technical Summary

Problems solved by technology

[0016] In the prior art, when the above-mentioned electrocardiogram sensor packaging process is used to process the electrocardiogram sensor, multiple curing treatments are required. The adhesive glue of the first light-emitting chip, the second light-emitting chip, the first photosensitive chip and the second photosensitive chip is cured by repeated heating. Afterwards, its adhesiveness is reduced, and the adhesion between the first light-emitting chip or the second light-emitting chip or the first photosensitive chip or the second photosensitive chip and the substrate is not firm, and it is easy to fall off, and the frame sticking process is after the wire bonding process, and the substrate During the transfer of the welding wire on the frame to the frame bonding process, it is easy to bend the welding wire or damage the substrate due to human operation, and the defective product rate is high

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