An open electrocardiogram sensor packaging process
A packaging process and electrocardiogram technology, applied in sensors, electrical solid devices, circuits, etc., can solve the problems of weak adhesion, reduced adhesion, easy to fall off, etc. Strong bonding effect
Active Publication Date: 2021-03-09
SHENZHEN STS MICROELECTRONICS CO LTD
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Problems solved by technology
[0016] In the prior art, when the above-mentioned electrocardiogram sensor packaging process is used to process the electrocardiogram sensor, multiple curing treatments are required. The adhesive glue of the first light-emitting chip, the second light-emitting chip, the first photosensitive chip and the second photosensitive chip is cured by repeated heating. Afterwards, its adhesiveness is reduced, and the adhesion between the first light-emitting chip or the second light-emitting chip or the first photosensitive chip or the second photosensitive chip and the substrate is not firm, and it is easy to fall off, and the frame sticking process is after the wire bonding process, and the substrate During the transfer of the welding wire on the frame to the frame bonding process, it is easy to bend the welding wire or damage the substrate due to human operation, and the defective product rate is high
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[0048] Below, the present invention will be further described in conjunction with the accompanying drawings and specific implementation methods. It should be noted that, under the premise of not conflicting, the various embodiments described below or the technical features can be combined arbitrarily to form new embodiments. .
[0049] Such as figure 1 An open ECG sensor packaging process shown, including
[0050] Film cutting process: paste the substrate on the ring with UV film attached, the cutting device cuts along the preset cutting line on the substrate, the cut substrate includes a base divided into preset sizes, and transfer the base to the film on the vehicle.
[0051] In the film cutting process, the cutting depth needs to be controlled so that after cutting, the upper and lower sides of the substrate have been completely penetrated along the cutting line, that is, the bases on the substrate are completely separated, and the UV film cannot be cut through. , that i...
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The invention discloses an open-type electrocardiogram sensor packaging process, film cutting process: paste a substrate on a ring with a UV film attached, cut the substrate into a base of a specified size along a preset cutting line, and place the base Transfer to the film carrier, frame sticking process; photosensitive chip sticking process: paste multiple photosensitive chips on the base; first curing process: cure the base after the photosensitive chip sticking process; light-emitting chip sticking process : paste the light-emitting chip on the base after the first curing; the second curing process: cure the base after the light-emitting chip pasting process; wire bonding process: use the bonding wire to connect the photosensitive chip and the light-emitting chip to the base Seat conduction; the open electrocardiogram sensor packaging process can prevent the light-emitting chip and photosensitive chip from being firmly bonded to the substrate and not easy to fall off, and the welding wire is not easy to bend, and the yield rate is high.
Description
technical field [0001] The invention relates to the technical field of packaging of electronic devices, in particular to an open electrocardiogram sensor packaging process. Background technique [0002] The electrocardiogram sensor is a sensor that can sense the action potential waveform of cells in different regions of the heart and convert it into a usable output signal. The packaging process is roughly as follows: [0003] 1. Marking; use laser to print dot matrix content on the back of the substrate, which can play a traceability role; [0004] 2. Paste the first photosensitive chip: Paste the first photosensitive chip on the substrate, [0005] 3. Curing for the first time: heating the substrate on which the first photosensitive chip is pasted, so that the bonding glue of the first photosensitive chip is cured; [0006] 4. Pasting of the second photosensitive chip: bonding the second photosensitive chip on the first cured substrate; [0007] 5. Second curing: heating...
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IPC IPC(8): H01L21/50H01L25/16A61B5/318
CPCA61B5/318H01L21/50H01L25/167
Inventor 林金旺曹晶张天宇
Owner SHENZHEN STS MICROELECTRONICS CO LTD