Radiator and electronic device with same

A technology for electronic devices and radiators, which is applied to circuit heating devices, housings with display/control units, instruments, etc., can solve the problems of increasing the thickness of electronic devices and not conforming to the thinning of electronic devices, so as to reduce time and ensure The effect of thinning requirements and improving production efficiency

Inactive Publication Date: 2020-01-31
SHENZHEN FUTAIHONG PRECISION IND CO LTD +1
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  • Abstract
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  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

This increases the thickness of the electronic device, which is not in line with the current trend of thinning electronic devices

Method used

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  • Radiator and electronic device with same
  • Radiator and electronic device with same
  • Radiator and electronic device with same

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Embodiment Construction

[0014] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without creative efforts fall within the protection scope of the present invention.

[0015] It should be noted that when an element is considered to be "connected" to another element, it may be directly connected to the other element or there may be intervening elements at the same time. When an element is referred to as being "disposed on" another element, it can be directly on the other element or intervening elements may also be present.

[0016] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as co...

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Abstract

The invention provides a radiator which includes at least a casing body. The casing body includes an upper casing body and a lower casing body. The upper casing body and the lower casing body are oppositely arranged and sealed to form a cavity. The radiator further includes a capillary structure and heat-dissipating fluid. The capillary structure and the heat-dissipating fluid are accommodated inthe cavity. The area of the upper casing body is larger than the area of the lower casing body. A protrusion is formed on the edge, which is opposite to the lower casing body, of the upper casing body. The invention further provides an electronic device with the radiator.

Description

technical field [0001] The invention relates to a radiator and an electronic device with the radiator. Background technique [0002] At present, VC (Vapor-Chamber, Vapor Chamber) is widely used in electronic devices to obtain better heat dissipation effect. However, the current assembly of VC mostly achieves the purpose of being installed on electronic devices by adding additional components on itself. This increases the thickness of the electronic device, which is not in line with the current trend of thinning electronic devices. Contents of the invention [0003] In view of this, it is necessary to provide a heat sink that does not affect the thickness of the electronic device itself. [0004] The invention also provides an electronic device with the radiator. [0005] A heat sink includes at least a shell, the shell includes an upper shell and a lower shell, the upper shell and the lower shell are oppositely arranged and sealed to form a cavity, the heat sink also in...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K7/20
CPCH05K7/20336G06F1/1626G06F1/203G06F2200/201H05K1/0201H05K5/0004H05K5/0017H05K5/0086H05K5/03H05K5/04H05K7/2039H05K9/0049
Inventor 张育维
Owner SHENZHEN FUTAIHONG PRECISION IND CO LTD
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