Radiator and electronic device with same

A technology for electronic devices and radiators, which is applied to circuit heating devices, housings with display/control units, instruments, etc., can solve the problems of increasing the thickness of electronic devices and not conforming to the thinning of electronic devices, so as to reduce time and ensure The effect of thinning requirements and improving production efficiency
CN110740611AInactive Publication Date: 2020-01-31SHENZHEN FUTAIHONG PRECISION IND CO LTD +1
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
SHENZHEN FUTAIHONG PRECISION IND CO LTD
Publication Date
2020-01-31
Estimated Expiration
Not applicable · inactive patent

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Abstract

The invention provides a radiator which includes at least a casing body. The casing body includes an upper casing body and a lower casing body. The upper casing body and the lower casing body are oppositely arranged and sealed to form a cavity. The radiator further includes a capillary structure and heat-dissipating fluid. The capillary structure and the heat-dissipating fluid are accommodated inthe cavity. The area of the upper casing body is larger than the area of the lower casing body. A protrusion is formed on the edge, which is opposite to the lower casing body, of the upper casing body. The invention further provides an electronic device with the radiator.
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Description

technical field

[0001] The invention relates to a radiator and an electronic device with the radiator. Background technique

[0002] At present, VC (Vapor-Chamber, Vapor Chamber) is widely used in electronic devices to obtain better heat dissipation effect. However, the current assembly of VC mostly achieves the purpose of being installed on electronic devices by adding additional components on itself. This increases the thickness of the electronic device, which is not in line with the current trend of thinning electronic devices. Contents of the invention

[0003] In view of this, it is necessary to provide a heat sink that does not affect the thickness of the electronic device itself.

[0004] The invention also provides an electronic device with the radiator.

[0005] A heat sink includes at least a shell, the shell includes an upper shell and a lower shell, the upper shell and the lower shell are oppositely arranged and sealed to form a cavity, the heat sink also in...

Claims

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