0.4mm Pitch Main Lead Ceramic Small Outline Case and Power Devices
A main lead, small-profile technology, applied in the direction of electric solid devices, semiconductor devices, semiconductor/solid device components, etc., can solve the problems that the pitch cannot reach 0.4mm, cannot realize electroplating, etc., and achieve the effect of electroplating
Active Publication Date: 2021-06-15
THE 13TH RES INST OF CHINA ELECTRONICS TECH GRP CORP
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Problems solved by technology
[0005] The purpose of the present invention is to provide a 0.4mm pitch main lead ceramic small-outline housing, aiming to solve the technical problem that the existing ceramic packaging small-outline housing cannot be electroplated and the pitch cannot reach 0.4mm
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[0027] In order to make the technical problems, technical solutions and beneficial effects to be solved by the present invention clearer, the present invention will be further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain the present invention, not to limit the present invention.
[0028] Please also refer to Figure 1 to Figure 7 , the 0.4mm pitch main lead ceramic small outline housing provided by the present invention will now be described. The 0.4mm pitch main lead ceramic small outline housing includes a ceramic body 5 provided with a core cavity 4 for packaging chips, a plurality of main pads 2 and main leads 3, and a plurality of main pads 2 along the ceramic body. The two opposite long sides of the upper end surface or the lower end surface of the body 5 are evenly arranged; the number of main leads 3 is the same as the number of the...
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Abstract
The invention provides a main lead ceramic small-outline shell with a pitch of 0.4 mm and a power device, which belong to the technical field of ceramic packaging and include a ceramic body, a plurality of main pads, a main lead, auxiliary pads and auxiliary leads, a plurality of main The pads are evenly arranged along the two opposite long sides of the upper or lower end of the ceramic body; the main leads are connected to the main pads in one-to-one correspondence, the pitch of the main leads is 0.4mm, and the main leads are bent parts; the auxiliary The welding pads are arranged symmetrically on the two opposite short sides of the ceramic body; the auxiliary leads are arranged on the auxiliary welding pads one by one correspondingly, and extend toward the ceramic body. The main lead ceramic small-outline housing with a pitch of 0.4mm provided by the invention can realize the electroplating of the small-outline ceramic packaging housing and the pitch can reach 0.4m.
Description
technical field [0001] The invention belongs to the technical field of ceramic packaging, and more specifically relates to a 0.4mm-pitch main lead ceramic small-outline casing and a power device. Background technique [0002] The CSOP case is a miniaturized mounting case. Its wing-shaped main lead is more conducive to absorbing the stress between the case and the PCB board and improving reliability. It is widely used in amplifiers, drivers, memories, comparators, etc. [0003] At present, plastic-encapsulated SOP devices (SOP (Small Out-Line Package Small Outline Package) 0.40mm pitch products have been widely used. The 0.40mm pitch products mainly use the plastic packaging process to mount the chip on the plastic substrate, and finally use the molding compound for the chip. Potting is implemented, and the main lead wire is drawn out from the middle of the shell. There are hidden dangers in the reliability of the package airtightness, internal thermal characteristics, storag...
Claims
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IPC IPC(8): H01L23/043H01L23/049H01L23/08
CPCH01L23/043H01L23/049H01L23/08
Inventor 杨振涛彭博
Owner THE 13TH RES INST OF CHINA ELECTRONICS TECH GRP CORP