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A microelectronic frame electroplating concealable hanger

A hidden, microelectronic technology, applied in the direction of electrolytic components, electrolytic process, etc., can solve the problems of low convenience, low functionality, and inability to realize rotation, and achieve the effect of preventing bump damage and obvious functionality

Active Publication Date: 2020-12-22
绍兴如融化纤有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] One is that the functionality is low. The above-mentioned application and the existing device can only realize a single hanging function or a hanging and shrinking function, but cannot realize the cleaning of the hook on this basis; moreover, the ease of use is low, The above applications and the hooks of the existing devices are all fixed suspension structures, which cannot be rotated, and are not convenient when electroplating individual parts that require full-angle electroplating

Method used

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  • A microelectronic frame electroplating concealable hanger
  • A microelectronic frame electroplating concealable hanger
  • A microelectronic frame electroplating concealable hanger

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Embodiment

[0037] as attached figure 1 to attach Figure 11 Shown:

[0038] The present invention provides a microelectronic frame electroplating concealable hanger, which includes a main body plate 1; the front surface of the main body plate 1 is in a rectangular array and is rotatably connected with four groups of six hooks 2 in total, and the back of the main body plate 1 The end face is in a rectangular array and is fixedly connected with four elastic expansion seats 3 by bolts, and the rear end face of the main body plate 1 is fixedly connected with a rear cover 4 by bolts, and an adjustment rod 5 is slidably connected to the rear cover 4; A shielding cover 6 is slidably connected, and a cleaning cotton block 7 is adhered in the shielding cover 6 .

[0039] Reference as Figure 10The hook 2 includes a hook main body 201, a baffle plate A202, a baffle plate B203, a card slot 204, and a gear 205. The hook main body 201 on the hook 2 is rotatably connected to the main body plate 1, ...

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Abstract

The invention provides a micro-electronic frame electroplating hiding type hanging tool, and relates to the field of electroplating hanging tools. The problems that a hanging function or hanging and contraction functions can only be singly achieved while hook cleaning on the basis cannot be achieved, hooks are each of a fixed type hanging structure, rotation cannot be achieved, and when specific components needing all-angle electroplating are electroplated, convenience is insufficient are solved. The micro-electronic frame electroplating hiding type hanging tool comprises a body plate, and thefront end face of the body plate is rotationally connected with four sets of hooks in a rectangular array manner, wherein each set of hooks include six hooks, and totally 24 hooks are arranged. Through cooperation of the body plate, the hooks, a shielding cover and a cleaning cotton block, hook hiding and leaking can be achieved, and electroplating layers on the surfaces of the hooks can be cleaned in the hook hiding and leaking process; and the hook structure is improved, the hooks on the device can be rotated and adjusted by 360 degrees, all-angle component electroplating is achieved or theelectroplating effect is observed.

Description

technical field [0001] The invention belongs to the technical field of electroplating racks, and more specifically relates to a concealable rack for microelectronic frame electroplating. Background technique [0002] Electroplating is the process of plating a thin layer of other metals or alloys on the surface of certain metals using the principle of electrolysis. It is a process of using electrolysis to attach a layer of metal film to the surface of metal or other material parts to prevent Metal oxidation (such as rust), improve wear resistance, electrical conductivity, reflective properties, corrosion resistance (copper sulfate, etc.) and enhance the appearance. The outer layer of many coins is also electroplated. [0003] For example, the application number: CN201822131949.1, the utility model discloses a concealable hanger for microelectronic frame electroplating, including a fixed frame, and mounting plates are fixed on both sides of the top of the fixed frame, and the...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C25D17/08
CPCC25D17/06
Inventor 王晓东
Owner 绍兴如融化纤有限公司