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An apparatus and a method of manufacturing the apparatus

A technology of component substrates and electronic components, applied in the direction of printed circuit manufacturing, structural connection of printed circuits, printed circuits, etc., can solve the problems of reduced light intensity, imperfection, and reduced light intensity, and achieve reduced capture, low cost, and quasi-easy effect

Inactive Publication Date: 2020-02-14
KONINKLJIJKE PHILIPS NV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Imperfect and uneven solder joints between the LED and the PCB on which the LED is mounted can both lead to a reduction in the intensity of light produced by the LED and a reduction in heat transfer from the LED to the PCB
The reduced light intensity affects the processing efficiency of the device, and the reduced heat transfer increases the risk of thermal damage to the LEDs

Method used

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  • An apparatus and a method of manufacturing the apparatus
  • An apparatus and a method of manufacturing the apparatus
  • An apparatus and a method of manufacturing the apparatus

Examples

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Embodiment Construction

[0029] As mentioned above, during some soldering processes, gas may be generated in the solder material and this gas may become trapped in the solder joint and thus cause the solder joint to form unevenly, resulting in the electronic components connected by the solder joint and sub-optimal functioning of equipment in which electronic components are installed. When electronic components having relatively small leads (ie, relatively small contact areas to be soldered) are soldered to a substrate, gases formed during the soldering process may possibly escape around the sides of the electronic components. However, if a soldering process is used to join a relatively large electronic component, or a soldering process is used to join a component substrate with an electronic component disposed thereon, some of the gas may not be able to escape around the sides of the electronic component or component substrate , and thus may be collected in the solder joint. Therefore, the inventor p...

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PUM

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Abstract

There is provided an apparatus comprising: a base substrate and a component substrate having at least two electronic components arranged thereon. At least one aperture is formed through an entire thickness of the component substrate. The at least one aperture is formed in an interspace between the at least two electronic components. The component substrate is coupled to the base substrate using asolder joint. Each of the at least two electronic components may comprise a light emitting diode element. A method of manufacturing the apparatus is also disclosed.

Description

technical field [0001] The present invention relates to devices having electronic components, and more particularly, to devices formed using a soldering process. The invention also relates to a method of manufacturing a device with electronic components. Background technique [0002] Electronic components are used in many technical fields. Such electronic components are often incorporated into devices and connected to other electronic components and power sources in the electronic system. In some devices, electronic components may be arranged on a printed circuit board (PCB) that mechanically supports and electrically connects the electronic components using electrical connectors (eg, conductive tracks) formed on the PCB. The electronic components may be connected to electrical connectors on the PCB using suitable electrical connections (e.g., solder joints), or may be mounted or formed onto an intermediate component substrate which itself may be soldered or otherwise moun...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K1/14
CPCH05K1/144H05K2201/0305H05K2201/09618H05K2203/1178H05K2201/09063H05K2201/09609H01L25/0753H01L33/005H01L33/62H01L2933/0066
Inventor M·I·博姆法F·A·尼普肯斯B·W·M·莫伊斯科普斯R·维哈根J·A·帕勒洛F·A·范阿比伦
Owner KONINKLJIJKE PHILIPS NV