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Semiconductor product process

A semiconductor and process technology, applied in the field of resist solution, which can solve problems such as bad and influence

Inactive Publication Date: 2020-02-21
TAIWAN SEMICON MFG CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

For example, a non-uniform distribution of functional units that facilitate exposure of the photoresist layer may have a significant impact on resolution, roughness (e.g., line edge roughness (LER) and / or line width roughness (line width roughness, LWR)), and / or the contrast of the final pattern, adversely affecting

Method used

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  • Semiconductor product process
  • Semiconductor product process
  • Semiconductor product process

Examples

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Embodiment Construction

[0040] The following disclosure provides many different embodiments, or examples, to demonstrate different aspects of the present disclosure. Specific examples of components and their arrangements of the present specification will be disclosed below to simplify the description of the present disclosure. Of course, these specific examples are not intended to limit the present disclosure. For example, if the content of the invention described below in this specification describes that the first component will be formed on or above the second component, it means that it includes the embodiment in which the formed first and second components are in direct contact, and also includes still Additional features may be formed between the first and second features described above, the first and second features being an embodiment where the first and second features are not in direct contact. In addition, various examples in this disclosure may use repeated reference signs and / or words....

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Abstract

The present invention provides a semiconductor product process. The semiconductor product process comprises a photoresist solution that includes a first solvent having a first volume and a second solvent having a second volume, where the first solvent is different from the second solvent and where the first volume is less than the second volume; dispersing the photoresist solution over a substrateto form a film, where the dispersing evaporates a portion of the first solvent and a portion of the second solvent such that a remaining portion of the first solvent is greater than a remaining portion of the second solvent; baking the film; after baking the film, exposing the film to form an exposed film; and developing the exposed film.

Description

technical field [0001] The present disclosure relates to a resist solution applicable to photolithography and its application. Background technique [0002] The semiconductor integrated circuit (integrated circuit, IC) industry has experienced exponential growth. Technological improvements in IC materials and design have produced many generations of ICs, with each generation having smaller and more complex circuits than the previous generation. However, such improvements or advances also increase the complexity of handling and manufacturing ICs. In order for these improvements or advances to be realized, similar developments are required in the field of IC processing and manufacturing. [0003] For example, lithography processes are widely used in the manufacture of integrated circuits (ICs), in which various resist patterns are transferred onto work pieces to form IC devices. In many cases, the quality of the photoresist layer (and the final photoresist pattern) formed on...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G03F7/16
CPCG03F7/16G03F7/168G03F7/0048G03F7/0392G03F7/162G03F7/091G03F7/70033H01L21/0276
Inventor 苏煜中罗冠昕郑雅如张庆裕林进祥
Owner TAIWAN SEMICON MFG CO LTD