A single particle test temperature control device and temperature control method with correction function

Abstract

A single-particle test temperature control device and temperature control method with a correction function, the device includes an integrated surface-mount tooling with a heating plate, a temperature control module with a power heat consumption correction function, and a detection module for multi-position measurement and correction. The method flow It includes chip test temperature setting based on power thermal analysis, device output setting based on chip temperature detection and test process control parameter determination. The invention realizes the direct contact between the test device and the heating position by designing a special surface-mounted heating tool, improves the efficiency, ensures the uniformity by controlling the heating area, and the temperature control module has the function of applying temperature correction based on the simulation data of the power heat consumption distribution of the test device , Improve the precision and accuracy of device temperature control. At the same time, the detection module has a dual-channel detector, and the control parameters of the test process are determined through calibration detection. The device of the invention is simple in composition, strong in versatility and high in accuracy, and the corresponding test method has the characteristics of easy engineering.

Description

technical field [0001] The invention relates to a single-particle test temperature control device and a temperature control method with a correction function, belonging to the technical field of single-particle tests. Background technique [0002] When a semiconductor device is used in a space environment, space high-energy particles will penetrate the interior of the semiconductor device and generate ionization on the path, and the circuit nodes will absorb the electrons and holes generated by the ionization, resulting in circuit errors. This effect is called single event effect . The ability to verify the anti-single event effect of semiconductor devices on the ground mainly relies on ground heavy ion accelerators to simulate single event tests, while the environment in space includes many factors, among which temperature has a significant impact on the single event effect of devices. Therefore, in order to effectively evaluate the application capability of the device, it...

AI Technical Summary

Problems solved by technology

[0005] Through the analysis of the single-particle test temperature control device that uses the heating plate method to heat the device, there are mainly two shortcomings: one is that the device sets the output temperature as the test target temperature, and the test process does not consider the device due to work. The temperature rise caused by power consumption, especially for power devices, the temperature rise of power consumption is relatively large, so it will cause deviations in the test results; second, the detection position is usually the device shell or the peripheral edge, especially if there is a temperature gradient in the device, the detection temperature and There are differences in the chip test temperature

At present, the single particle test temperature does not consider the correction of the deviation. In addition, the tooling design for device heating has an optimal design space, so the temperature control device and test method need to be further improved and perfected

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