Selective area laser melting device for forming die machining
A technology of selective laser and forming molds, applied in the direction of additive processing, additive manufacturing, process efficiency improvement, etc., can solve the problems of high manufacturing cost, difficult maintenance, complicated operation, etc. high effect
Active Publication Date: 2020-03-24
安徽哈特三维科技有限公司
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Problems solved by technology
[0004] The object of the present invention is to provide a selective laser melting device for forming mold processing, so as to solve the problems of complex structure, cumbersome operation, high manufacturing cost and difficult post-maintenance of the selective laser melting processing device currently on the market in the above-mentioned background technology
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[0024] The technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. The specific embodiments described here are only used to explain the present invention, but not to limit the present invention. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative work shall fall within the protection scope of the present invention.
[0025] Such as Figure 1-5 As shown, the present invention provides a selective laser melting device for forming mold processing, comprising a first box body 1, a first fixing plate 2 welded on one side of the rear end of the first box body 1, and the first fixing A first servo motor 3 is fixed on the board 2 b...
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The invention discloses a selective area laser melting device for forming die machining. The device comprises a first box body, wherein a first servo motor is mounted at a rear end of the first box body, a first lead screw is fixed to an output shaft of the first servo motor, the first lead screw is in threaded connection with a moving block, a mounting frame is welded on the moving block, a slider is fixed in the middle of one end of the mounting frame away from the moving block, a sliding groove matched with the sliding block is formed on a front side of the interior of the first box body, the sliding block slides in the sliding groove, a powder scraping mechanism is arranged on the mounting frame, a workbench is arranged below the powder scraping mechanism, a lifting mechanism is arranged on a lower side of the workbench and located in the middle of the interior of the first box body, a material carrying table is arranged on one side of the workbench and fixed in the first box body,and an automatic powder supply mechanism is arranged at the end, away from the material carrying table, of the workbench and located in the first box body. The device is advantaged in that automaticspreading and feeding are achieved, the structure is simple, operation is convenient, and manufacturing cost is low.
Description
Technical field [0001] The invention belongs to the technical field of laser melting devices, and particularly relates to a selective laser melting device for forming mold processing. Background technique [0002] Laser additive manufacturing technology is a typical rapid prototyping technology, which mainly uses high-energy laser beams to melt metal powder and stack them layer by layer to directly form high-performance complex metal parts. The laser selective melting technology is a technology that uses a high-energy laser beam to scan the pre-laid metal powder according to a predetermined scanning path to completely melt it, and then cool and solidify it to form a technology. [0003] Some existing forming molds are processed by selective laser melting technology due to their complicated shapes, difficult machining with machine tools, low precision, and low work efficiency. The current selective laser melting processing devices on the market have complex structures, cumbersome op...
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Patent Timeline
Login to View More IPC IPC(8): B22F3/105B33Y30/00B33Y40/00
CPCB33Y30/00B33Y40/00B22F10/00B22F10/73B22F10/28B22F12/67B22F12/222B22F12/50Y02P10/25
Inventor 陈大勇刘桐彭泽丛秦东沈力谢春林
Owner 安徽哈特三维科技有限公司