Circuit board heating method and device based on circuit board heating equipment

A heating method and technology of heating equipment, which are applied in the direction of assembling printed circuits with electrical components, using electric methods for temperature control, electrical program control, etc., can solve problems such as difficult circuit board heating control, and achieve the effect of precise heating control

Active Publication Date: 2020-03-24
HEBEI UNIVERSITY OF SCIENCE AND TECHNOLOGY +1
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  • Abstract
  • Description
  • Claims
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Problems solved by technology

[0003] At present, the control of circuit board heating mostly adopts the heating control method of reflow furnace, which is realized by conveying the circuit board through the heating area of ​​the reflow furnace through the conveyor belt, and the heating area of ​​the reflow furnace is much larger than the area of ​​the circuit board. way, it is difficult to more precisely control the heating of the circuit board

Method used

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  • Circuit board heating method and device based on circuit board heating equipment
  • Circuit board heating method and device based on circuit board heating equipment
  • Circuit board heating method and device based on circuit board heating equipment

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Embodiment Construction

[0054] In the following description, specific details such as specific system structures and technologies are presented for the purpose of illustration rather than limitation, so as to thoroughly understand the embodiments of the present invention. It will be apparent, however, to one skilled in the art that the present invention may be practiced in other embodiments without these specific details. In other instances, detailed descriptions of well-known systems, devices, circuits, and methods are omitted so as not to obscure the description of the present application with unnecessary detail.

[0055] It should be understood that when used in this specification and the appended claims, the term "comprising" indicates the presence of described features, integers, steps, operations, elements and / or components, but does not exclude one or more other features. , whole, step, operation, element, component and / or the presence or addition of a collection thereof.

[0056] It should a...

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Abstract

The invention discloses a circuit board heating method and device based on circuit board heating equipment, and the method comprises the steps: starting the heating function of a heating plate; monitoring the real-time temperature of the circuit board, and fixing the circuit board by a fixing device; and based on the monitored real-time temperature of the circuit board and preset temperature reference information, controlling the motor to drive the heating plate to be close to or far away from the circuit board. According to the scheme, in practical application, the temperature reference information is reasonably preset, so that the circuit board can be heated and controlled more accurately.

Description

technical field [0001] The present application belongs to the field of Surface Mounting Technology (SMT, Surface Mounting Technology), and in particular relates to a circuit board heating method and device based on circuit board heating equipment. Background technique [0002] The control of circuit board heating is an important link in the SMT manufacturing of circuit boards. The control of circuit board heating not only affects normal production, but also affects the quality and reliability of final products. [0003] At present, the control of circuit board heating mostly adopts the heating control method of reflow furnace, which is realized by conveying the circuit board through the heating area of ​​the reflow furnace through the conveyor belt, and the heating area of ​​the reflow furnace is much larger than the area of ​​the circuit board. way, it is difficult to more accurately control the heating of the circuit board. Contents of the invention [0004] The present...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/34G05D23/19G05B19/04
CPCG05B19/04G05D23/19H05K3/34
Inventor 霍彦明李争张路成李晓伟谷存江
Owner HEBEI UNIVERSITY OF SCIENCE AND TECHNOLOGY
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