Multi-layer composite heat preservation and insulation plate and preparation method thereof

A technology of thermal insulation board and thermal insulation layer, applied in the direction of chemical instruments and methods, layered products, carbon compounds, etc., can solve the problems of poor thermal insulation effect, large deformation coefficient, easy to burn, etc., and achieve increased thermal insulation Heat insulation effect, good thermal insulation performance, and enhanced flame retardant function

Inactive Publication Date: 2020-03-27
XIAN TECHNOLOGICAL UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The disadvantages are: not resistant to aging, large deformation coefficient, poor stability, poor safety, easy to burn, poor ecological environmental protection, difficult construction, high engineering cost, limited resources and difficult to recycle.
[0003] Traditional thermal insulation boards ge

Method used

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  • Multi-layer composite heat preservation and insulation plate and preparation method thereof
  • Multi-layer composite heat preservation and insulation plate and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Example Embodiment

[0034] Example 1

[0035] In the multi-layer composite thermal insulation board provided in this embodiment, the structure of the thermal insulation board from the inside to the outside is the bonding mortar layer 1, the reinforcement layer 2, the heat insulation layer 3, the flame retardant layer 4 and the decorative layer 5. Adhesive mortar layer 1, reinforcement layer 2, thermal insulation layer 3, flame retardant layer 4 and decorative layer 5 are bonded and pressed with an inorganic non-combustible adhesive to form an integrated structure, and the total thickness of the thermal insulation board is 15cm ;

[0036] The thermal insulation layer 3 is composed of the following components by weight: 32 parts of polystyrene foam particles, 6 parts of aluminum hydroxide, 6 parts of ceramic fiber, 6 parts of modified graphene oxide, and 2 parts of silane coupling agent.

[0037] Among them, the preparation method of the modified graphene oxide is: dissolving the weighed graphene ...

Example Embodiment

[0047] Example 2

[0048] In the multi-layer composite thermal insulation board provided in this embodiment, the structure of the thermal insulation board from the inside to the outside is the bonding mortar layer 1, the reinforcement layer 2, the heat insulation layer 3, the flame retardant layer 4 and the decorative layer 5. Adhesive mortar layer 1, reinforcement layer 2, thermal insulation layer 3, flame retardant layer 4 and decorative layer 5 are bonded and pressed with an inorganic non-combustible adhesive to form an integrated structure, and the total thickness of the thermal insulation board is 5cm ;

[0049] The thermal insulation layer 3 is composed of the following components by weight: 25 parts of polystyrene foam particles, 5 parts of aluminum hydroxide, 8 parts of ceramic fiber, 5 parts of modified graphene oxide, and 1 part of silane coupling agent.

[0050] Among them, the preparation method of the modified graphene oxide is: dissolving the weighed graphene ox...

Example Embodiment

[0060] Example 3

[0061] In the multi-layer composite thermal insulation board provided in this embodiment, the structure of the thermal insulation board from the inside to the outside is the bonding mortar layer 1, the reinforcement layer 2, the heat insulation layer 3, the flame retardant layer 4 and the decorative layer 5. Adhesive mortar layer 1, reinforcement layer 2, thermal insulation layer 3, flame retardant layer 4 and decorative layer 5 are bonded and pressed with an inorganic non-combustible adhesive to form an integrated structure, and the total thickness of the thermal insulation board is 20cm ;

[0062] The thermal insulation layer is composed of the following components by weight: 40 parts of polystyrene foam particles, 8 parts of aluminum hydroxide, 5 parts of ceramic fiber, 8 parts of modified graphene oxide, and 3 parts of silane coupling agent.

[0063] Among them, the preparation method of the modified graphene oxide is: dissolving the weighed graphene ox...

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Abstract

The invention relates to a thermal insulation material and particularly relates to a multi-layer composite thermal insulation board and a preparation method thereof. The multi-layer composite heat preservation and insulation plate structurally comprises a bonding mortar layer, a reinforcing layer, a heat preservation and insulation layer, a flame-retardant layer and a facing layer from inside to outside in sequence, and the bonding mortar layer, the reinforcing layer, the heat preservation and insulation layer, the flame-retardant layer and the facing layer are bonded and pressed into an integrated structure through adhesives. The heat preservation and insulation layer is prepared from, by weight, 25-40 parts of polystyrene foam particles, 5-8 parts of aluminum hydroxide, 5-8 parts of ceramic fibers, 5-8 parts of modified graphene oxide and 1-3 parts of silane coupling agent. The multi-layer composite heat preservation and insulation plate can reach the national A-level fireproof standard, the heat preservation and insulation effect of the heat preservation and insulation plate is improved by adding the modified graphene oxide, and the flame retardant function of the heat preservation and insulation plate is enhanced.

Description

technical field [0001] The invention relates to a thermal insulation material, in particular to a multilayer composite thermal insulation board and a preparation method thereof. Background technique [0002] At present, organic and inorganic insulation materials are widely used in industrial equipment and building walls. There are many types of building energy-saving materials, each with its own characteristics. From the perspective of building enclosure wall insulation and building and roof insulation, there are two main categories: 1. Organic insulation materials: such as expanded polystyrene board (EPS, extruded polystyrene board (XPS) , spray polyurethane (SPU), and polystyrene particles, etc. Organic thermal insulation materials have the advantages of light weight, good processability, high compactness, and good thermal insulation effect. The disadvantages are: not resistant to aging, large deformation coefficient, and poor stability , poor safety, easy to burn, poor ...

Claims

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Application Information

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IPC IPC(8): B32B15/20B32B33/00B32B27/06B32B27/00B32B13/00B32B13/12B32B9/00B32B9/04C01B32/198
CPCB32B9/00B32B9/04B32B13/00B32B13/12B32B15/20B32B27/06B32B27/302B32B33/00C01B32/198
Inventor 吴佳妮郭丹薛济仁
Owner XIAN TECHNOLOGICAL UNIV
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