Multi-layer composite heat preservation and insulation plate and preparation method thereof
Patent Information
- Authority / Receiving Office
- CN · China
- Current Assignee / Owner
- XIAN TECHNOLOGICAL UNIV
- Publication Date
- 2020-03-27
- Estimated Expiration
- Not applicable · inactive patent
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Abstract
Description
technical field
[0001] The invention relates to a thermal insulation material, in particular to a multilayer composite thermal insulation board and a preparation method thereof. Background technique
[0002] At present, organic and inorganic insulation materials are widely used in industrial equipment and building walls. There are many types of building energy-saving materials, each with its own characteristics. From the perspective of building enclosure wall insulation and building and roof insulation, there are two main categories: 1. Organic insulation materials: such as expanded polystyrene board (EPS, extruded polystyrene board (XPS) , spray polyurethane (SPU), and polystyrene particles, etc. Organic thermal insulation materials have the advantages of light weight, good processability, high compactness, and good thermal insulation effect. The disadvantages are: not resistant to aging, large deformation coefficient, and poor stability , poor safety, easy to burn, poor ...