With thermal insulation middle frame structure and electronic equipment

Abstract

The invention provides a middle frame structure with heat insulation and an electronic device. The middle frame is applied in an electronic device, and includes a body and a frame unit. The frame unit includes an inner layer, an outer layer, and a thermal insulation layer, and the thermal insulation layer is located between the inner layer and the outer layer. , the inner layer is adjacent to the main body, the outer layer is located at the outermost side of the frame unit, and the heat transfer of the main body is blocked by the heat insulating layer to the outer layer of the frame unit.

Description

【Technical field】 [0001] The present invention relates to the field of portable electronic equipment, in particular to a middle frame structure with thermal insulation and electronic equipment. 【Background technique】 [0002] At present, smart personal electronic devices such as mobile phones, tablet computers or portable readers are getting larger in size and thinner in thickness, resulting in worse and worse heat dissipation performance of electronic devices. Generated by the operation of functional units, such as the operation of the central processing unit (especially the configuration of multi-core computing units for the improvement of execution speed, which will worsen the heat dissipation problem of the terminal equipment), batteries, power converters, display screens, etc. All will lead to increased or aggravated heat generation of electronic equipment. At present, the heat source of most electronic devices is fixed on the middle frame structure of the electronic d...

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Problems solved by technology

[0002] At present, the size of smart personal electronic devices such as mobile phones, tablet computers or portable readers is getting bigger and thinner, which makes the heat dissipation performance of electronic devices worse and worse. However, most of the heat generated in electronic devices comes from various Generated by the operation of functional units, such as the operation of central processing units (especially the configuration of multi-core computing units for the improvement of execution speed, which will worsen the heat dissipation problem of terminal equipment), batteries, power converters, display screens, etc. Both will cause the heat generation of electronic equipment to increase or aggravate

At present, the heat source of most electronic equipment is fixed on the middle frame structure of the electronic equipment, so the middle frame first absorbs the heat generated by the execution of each functional unit, so after the electronic equipment is turned on, the temperature of the middle frame is very easy to rise, resulting in The temperature of the body and the outer edge of the frame is extremely high. When the user holds the electronic device, due to the large size of the current electronic device (for example, the mainstream of the touch mobile phone is more than 5 inches), the user can hardly fully grasp it. Using the grip between fingers, the contact points or positions for gripping electronic devices are mostly located on the outer edge or longer sides of the middle frame, causing high temperature conduction to the outer edge of the middle frame, which will affect or cause troubles for users in use and inconvenient

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