The invention belongs to the technical field of wood processing, and relates to a manufacturing method of a density fiberboard for an E0-level electronic circuit base plate. A secondary gluing technology is adopted, and the manufacturing method comprises the steps that wood peeling, chipping, wood chip screening, washing, pre-cooking, cooking and hot grinding are carried out; adding of waterproofagent and adjusting and applying of an E0-level damp-proof adhesive are carried out; and adding of an auxiliary, drying and sorting, adjusting and applying of an E0-level high-solid-content adhesive,adding of a fire retardant, paving and forming, pre-pressing, hot pressing, turning plate cooling, sanding, inspection and dividing and packaging and warehousing are carried out. The adhesive is addedtwice, so that the pre-curing influence is reduced, the adhesive bonding effect and full wrapping can be brought into full play, and meanwhile energy consumption of a heat energy center is reduced. The produced fiberboard for the E0-level electronic circuit base plate overcomes the defects that the fiberboard is prone to damp deformation and aging, and the hardness is not enough, the service cycle is prolonged, the fire retardant function is added, the combustion risk caused by too high local temperature in the electronic circuit base plate using process is effectively avoided, and the application field of the fiberboard is further expanded.