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Manufacturing method of density fiberboard for E0-level electronic circuit base plate

A technology of density fiberboard and electronic circuit, applied in the field of wood processing, can solve the problems of insufficient surface cleanliness, not heat-resistant, not flame-retardant, easily deformed by moisture, etc., so as to avoid the risk of burning, prevent deformation from moisture, and solve the problem of deformation from moisture. Effect

Active Publication Date: 2020-02-04
DARE WOOD BASED PANEL GRP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] In recent years, the backing board of circuit boards in the electronics industry has gradually adopted density fiberboard. When the existing fiberboard is used as an electronic circuit backing board, it has insufficient hardness, is easy to be deformed by moisture, is not heat-resistant and flame-retardant, and will produce burrs when drilling. Cleanliness is not enough, environmental protection upgrades and many other problems

Method used

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  • Manufacturing method of density fiberboard for E0-level electronic circuit base plate
  • Manufacturing method of density fiberboard for E0-level electronic circuit base plate
  • Manufacturing method of density fiberboard for E0-level electronic circuit base plate

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Experimental program
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Effect test

Embodiment

[0038] 2.5mm E 0 Manufacturing process of density fiberboard for grade electronic circuit backing board:

[0039] 1.E 0 Preparation of grade moisture-proof high-performance adhesive

[0040] The amount of melamine accounts for 10% of the weight of the whole liquid resin, and the total molar ratio of formaldehyde to urea and melamine is 0.82.

[0041] A, enter the first batch of formaldehyde (accounting for 85% of the total amount of formaldehyde), add sodium hydroxide solution (30%) to adjust the pH to 8.5-9.0;

[0042] B, drop into first batch of melamine (accounting for 50% of triamine total amount), be warming up to 88-90 ℃ gradually, react 30min;

[0043] C. Put in the first batch of urea, make the molar ratio of formaldehyde to urea and triamine at 1.94, react at 80-85°C for 20 minutes, add formic acid to adjust the pH to 6.7, and react until the viscosity is 15s;

[0044] D, add sodium hydroxide to adjust Ph=10, add the second batch of formaldehyde (accounting for 15% ...

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Abstract

The invention belongs to the technical field of wood processing, and relates to a manufacturing method of a density fiberboard for an E0-level electronic circuit base plate. A secondary gluing technology is adopted, and the manufacturing method comprises the steps that wood peeling, chipping, wood chip screening, washing, pre-cooking, cooking and hot grinding are carried out; adding of waterproofagent and adjusting and applying of an E0-level damp-proof adhesive are carried out; and adding of an auxiliary, drying and sorting, adjusting and applying of an E0-level high-solid-content adhesive,adding of a fire retardant, paving and forming, pre-pressing, hot pressing, turning plate cooling, sanding, inspection and dividing and packaging and warehousing are carried out. The adhesive is addedtwice, so that the pre-curing influence is reduced, the adhesive bonding effect and full wrapping can be brought into full play, and meanwhile energy consumption of a heat energy center is reduced. The produced fiberboard for the E0-level electronic circuit base plate overcomes the defects that the fiberboard is prone to damp deformation and aging, and the hardness is not enough, the service cycle is prolonged, the fire retardant function is added, the combustion risk caused by too high local temperature in the electronic circuit base plate using process is effectively avoided, and the application field of the fiberboard is further expanded.

Description

technical field [0001] The invention belongs to the technical field of wood processing, relates to the manufacture of fiberboards, in particular to an E 0 Method for manufacturing density fiberboard for backing boards for electronic circuits. Background technique [0002] Density fiberboard is a man-made board made of wood fiber or other plant fiber, prepared from fiber, applied with synthetic resin, and pressed under heat and pressure. Due to the advantages of uniform structure, fine material, stable performance, high impact resistance and easy processing, MDF is widely used in many fields such as furniture, decoration, musical instruments and packaging. [0003] In recent years, the backing board of circuit boards in the electronics industry has also gradually adopted density fiberboard. When the existing fiberboard is used as an electronic circuit backing board, it has insufficient hardness, is easy to be deformed by moisture, is not heat-resistant and flame-retardant, a...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B27N3/04B27N3/12B27N3/20B27N3/18B27N1/02C08G12/38C09J161/30
CPCB27N3/002B27N3/04B27N3/12B27N3/203B27N3/18B27N1/0209C08G12/38C09J161/30
Inventor 陈秀兰
Owner DARE WOOD BASED PANEL GRP
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