Manufacturing method of density fiberboard for E0-level electronic circuit base plate

Abstract

The invention belongs to the technical field of wood processing, and relates to a manufacturing method of a density fiberboard for an E0-level electronic circuit base plate. A secondary gluing technology is adopted, and the manufacturing method comprises the steps that wood peeling, chipping, wood chip screening, washing, pre-cooking, cooking and hot grinding are carried out; adding of waterproofagent and adjusting and applying of an E0-level damp-proof adhesive are carried out; and adding of an auxiliary, drying and sorting, adjusting and applying of an E0-level high-solid-content adhesive,adding of a fire retardant, paving and forming, pre-pressing, hot pressing, turning plate cooling, sanding, inspection and dividing and packaging and warehousing are carried out. The adhesive is addedtwice, so that the pre-curing influence is reduced, the adhesive bonding effect and full wrapping can be brought into full play, and meanwhile energy consumption of a heat energy center is reduced. The produced fiberboard for the E0-level electronic circuit base plate overcomes the defects that the fiberboard is prone to damp deformation and aging, and the hardness is not enough, the service cycle is prolonged, the fire retardant function is added, the combustion risk caused by too high local temperature in the electronic circuit base plate using process is effectively avoided, and the application field of the fiberboard is further expanded.

Description

technical field [0001] The invention belongs to the technical field of wood processing, relates to the manufacture of fiberboards, in particular to an E 0 Method for manufacturing density fiberboard for backing boards for electronic circuits. Background technique [0002] Density fiberboard is a man-made board made of wood fiber or other plant fiber, prepared from fiber, applied with synthetic resin, and pressed under heat and pressure. Due to the advantages of uniform structure, fine material, stable performance, high impact resistance and easy processing, MDF is widely used in many fields such as furniture, decoration, musical instruments and packaging. [0003] In recent years, the backing board of circuit boards in the electronics industry has also gradually adopted density fiberboard. When the existing fiberboard is used as an electronic circuit backing board, it has insufficient hardness, is easy to be deformed by moisture, is not heat-resistant and flame-retardant, a...

AI Technical Summary

Problems solved by technology

[0003] In recent years, the backing board of circuit boards in the electronics industry has gradually adopted density fiberboard. When the existing fiberboard is used as an electronic circuit backing board, it has insufficient hardness, is easy to be deformed by moisture, is not heat-resistant and flame-retardant, and will produce burrs when drilling. Cleanliness is not enough, environmental protection upgrades and many other problems

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