The invention belongs to the technical field of
wood processing, and relates to a manufacturing method of a density
fiberboard for an E0-level
electronic circuit base plate. A secondary gluing technology is adopted, and the manufacturing method comprises the steps that wood peeling, chipping, wood
chip screening, washing, pre-cooking, cooking and hot
grinding are carried out; adding of waterproofagent and adjusting and applying of an E0-level damp-proof
adhesive are carried out; and adding of an auxiliary,
drying and sorting, adjusting and applying of an E0-level high-
solid-content
adhesive,adding of a
fire retardant, paving and forming, pre-pressing,
hot pressing, turning plate cooling, sanding, inspection and dividing and packaging and warehousing are carried out. The
adhesive is addedtwice, so that the pre-curing influence is reduced, the
adhesive bonding effect and full wrapping can be brought into full play, and meanwhile
energy consumption of a
heat energy center is reduced. The produced
fiberboard for the E0-level
electronic circuit base plate overcomes the defects that the
fiberboard is prone to damp deformation and aging, and the
hardness is not enough, the service cycle is prolonged, the
fire retardant function is added, the
combustion risk caused by too high local temperature in the
electronic circuit base plate using process is effectively avoided, and the application field of the fiberboard is further expanded.