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Manufacturing method of density fiberboard for e0 grade electronic circuit backing board

A technology of density fiberboard and electronic circuit, applied in the field of wood processing, can solve the problems of insufficient surface cleanliness, insufficient hardness, not heat-resistant and not flame-retardant, etc., to avoid the risk of burning, improve the function and quality, and increase the flame-retardant function Effect

Active Publication Date: 2022-04-19
DARE WOOD BASED PANEL GRP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] In recent years, the backing board of circuit boards in the electronics industry has gradually adopted density fiberboard. When the existing fiberboard is used as an electronic circuit backing board, it has insufficient hardness, is easy to be deformed by moisture, is not heat-resistant and flame-retardant, and will produce burrs when drilling. Cleanliness is not enough, environmental protection upgrades and many other problems

Method used

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  • Manufacturing method of density fiberboard for e0 grade electronic circuit backing board
  • Manufacturing method of density fiberboard for e0 grade electronic circuit backing board
  • Manufacturing method of density fiberboard for e0 grade electronic circuit backing board

Examples

Experimental program
Comparison scheme
Effect test

Embodiment

[0038] 2.5mm E 0 Manufacturing process of density fiberboard for grade electronic circuit backing board:

[0039] 1.E 0 Preparation of grade moisture-proof high-performance adhesive

[0040] The amount of melamine accounts for 10% of the weight of the whole liquid resin, and the total molar ratio of formaldehyde to urea and melamine is 0.82. A, enter the first batch of formaldehyde (accounting for 85% of the total amount of formaldehyde), add sodium hydroxide solution (30%) to adjust the pH to 8.5-9.0;

[0041]B, drop into first batch of melamine (accounting for 50% of triamine total amount), be warming up to 88-90 ℃ gradually, react 30min;

[0042] C. Put in the first batch of urea, make the molar ratio of formaldehyde, urea and triamine at 1.94, react at 80-85°C for 20 minutes, add formic acid to adjust the pH to 6.7, and react until the viscosity is 15s;

[0043] D, add sodium hydroxide to adjust Ph=10, add the second batch of formaldehyde (accounting for 15% of the tot...

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Abstract

The invention belongs to the technical field of wood processing and relates to an E 0 The manufacturing method of density fiberboard for grade electronic circuit backing board adopts the secondary sizing process, including wood peeling-shaving-wood chip screening-washing-precooking-steaming-hot grinding, adding waterproofing agent-adjustment E 0 Grade moisture-proof adhesive, add additives - dry sorting - blending E 0 High-grade high-solid content adhesives-adding flame retardants-pavement molding-pre-pressing-hot pressing-flap cooling-sanding-inspection and grading-packaging and storage. The adhesive of the present invention adopts the method of secondary addition, which reduces the influence of pre-curing, can give full play to the bonding effect of the adhesive and fully wraps it, and at the same time reduces the energy consumption of the heat energy center. produced E 0 High-grade fiberboard for electronic circuit backing boards solves defects such as moisture deformation, aging, and insufficient hardness, prolongs the service life, increases the flame retardant function, and effectively avoids the risk of burning caused by excessive local temperature during use of electronic circuit backing boards, and further expands Fields of application of fiberboard.

Description

technical field [0001] The invention belongs to the technical field of wood processing and relates to the manufacture of fiberboards, in particular to a method for manufacturing density fiberboards for E0 grade electronic circuit backing boards. Background technique [0002] Density fiberboard is a man-made board made of wood fiber or other plant fiber, prepared from fiber, applied with synthetic resin, and pressed under heat and pressure. Due to the advantages of uniform structure, fine material, stable performance, high impact resistance and easy processing, MDF is widely used in many fields such as furniture, decoration, musical instruments and packaging. [0003] In recent years, the backing board of circuit boards in the electronics industry has also gradually adopted density fiberboard. When the existing fiberboard is used as an electronic circuit backing board, it has insufficient hardness, is easy to be deformed by moisture, is not heat-resistant and flame-retardant,...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B27N3/04B27N3/12B27N3/20B27N3/18B27N1/02C08G12/38C09J161/30
CPCB27N3/002B27N3/04B27N3/12B27N3/203B27N3/18B27N1/0209C08G12/38C09J161/30
Inventor 陈秀兰
Owner DARE WOOD BASED PANEL GRP
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