Die attach position positioning device with enhanced photomask contrast

Abstract

The present invention provides a device for positioning a die attachment position with improved mask contrast, comprising a mask member, a die attachment body, an image capture member, an electromagnetic wave emitting member, an attaching member, and a positioning adjustment member, and the mask member The surface of the mask is engraved with a predetermined pattern, and the penetration or reflectance of the predetermined pattern to electromagnetic waves is different from that of the unengraved surface of the mask component to form an absolute precision mark. The image capture component captures the attached body including the die and The image for locating the die attaching position of the absolute precision mark, the electromagnetic wave emitting member emits electromagnetic waves toward the image capturing member by means of electromagnetic waves penetrating the mask member or reflecting the electromagnetic wave through the mask member, based on the image for locating the die attaching position Precise adjustment is made so that the attaching member corresponds to a preset die attaching position on the die attaching surface.

Description

technical field [0001] The invention relates to a die attaching position positioning device, in particular to a die attaching position positioning device capable of improving the contrast of a mask. Background technique [0002] In the semiconductor wafer-level packaging process, the wafer must be cut into multiple dies, and then the good products must be picked out and re-attached to the adhesive film, glass or wafer for subsequent processing. The attachment process is to use precision equipment such as robotic arms and movable stages to accurately control the attachment position of the die. [0003] However, the traditional way of locating the die attachment position uses the attached die as a reference point, so there is relative accuracy between two adjacent dies, but the overall die attachment position may not have absolute accuracy. If there is a slight error in the attachment position of the initial die (such as deviation from the X-axis, deviation from the Y-axis, o...

AI Technical Summary

Problems solved by technology

[0003] However, the traditional way of locating the die attachment position uses the attached die as a reference point, so there is relative accuracy between two adjacent dies, but the overall die attachment position may not have absolute accuracy

If there is a slight error in the attachment position of the initial die (such as deviation from the X-axis, deviation from the Y-axis, or incorrect angle), these errors may accumulate to a considerable extent after attaching several dies, which will seriously affect the subsequent processing process and cause Rising cost and low yield

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