Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Far-field super-resolution reconstruction method based on Fourier laminated imaging

A technology of super-resolution reconstruction and Fourier stacking, applied in image data processing, graphic image conversion, instruments, etc., can solve the problem of no far-field application, and achieve the effect of reducing reconstruction time and algorithm complexity.

Active Publication Date: 2020-03-31
HANGZHOU DIANZI UNIV
View PDF6 Cites 4 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] Although the application of the wavefront modulation method has achieved good results in the past few years, we found that this method is basically used in the near-field modulation system and has not been well applied in the far-field. Based on this, we propose A far-field super-resolution reconstruction method based on Fourier stack imaging

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Far-field super-resolution reconstruction method based on Fourier laminated imaging
  • Far-field super-resolution reconstruction method based on Fourier laminated imaging
  • Far-field super-resolution reconstruction method based on Fourier laminated imaging

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0062] The present invention will be described in detail below in conjunction with the accompanying drawings.

[0063] Step 1: Build and debug hardware system

[0064] figure 1 It is a schematic diagram of the built system, in which the plane of the sample, the scattering sheet and the plane of the objective lens are parallel to each other. The sample is located in the far field of the objective lens, and the laser light is perpendicular to the sample plane.

[0065] When debugging the system, first remove the sample, control the drive displacement device to move in the Z direction, make the scattering device located at the focal plane, and then fix the sample for image acquisition.

[0066] Step 2: image acquisition;

[0067] During image acquisition, all other light sources except the laser need to be turned off. The computer drives the displacement device to move in the shape of "back" in the X-Y plane, and the step size of each movement is 1 mm. One image acquisition ...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention discloses a far-field super-resolution reconstruction method based on Fourier laminated imaging. The method comprises the steps of through a series of obtained low-resolution images, rapidly reconstructing amplitude information and phase information of a far-field sample; placing a low-cost scattering device between the sample and the objective lens, placing the low-cost scattering device on the focal plane of the objective lens, and modulating the sample information irradiated by the coherent light; placing a sample in a far field of the objective lens at a position which is 50-80cm away from the focal plane of the objective lens, and performing coherent light irradiation; in a low-resolution image acquisition process, regularly moving a scattering sheet up and down and leftand right to obtain more complete sample modulation information; the resolution exceeding the diffraction limit of the objective lens is obtained by modulating the sample information through the multiple scattering sheets, so that the super-resolution reconstruction of the sample is realized. The limitation of the distance between the sample and the scattering device is broken through. And the algorithm complexity is greatly reduced, and the reconstruction time is reduced.

Description

technical field [0001] The invention relates to the field of image super-resolution reconstruction, in particular to a far-field super-resolution reconstruction method based on Fourier stack imaging. Background technique [0002] Image resolution is an important indicator to measure image quality. During the image production process, due to hardware limitations of the imaging system, environmental interference, object movement, etc., the image resolution is reduced. Image super-resolution reconstruction methods aim to obtain high-resolution images from existing low-resolution images. [0003] With the improvement of industrial manufacturing technology, the requirements for visual measurement accuracy continue to increase, and image resolution directly affects the extraction of key feature information in the measured scene and the accuracy of final measurement, so the demand for high-resolution images is increasing. [0004] Designing a diffraction-limited high-resolution l...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): G06T3/40
CPCG06T3/4053
Inventor 颜成钢王瑞海高宇涵孙垚棋张继勇张勇东沈韬
Owner HANGZHOU DIANZI UNIV
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com