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Enhanced cooling kit for components of a computing device and related systems and methods

A computing device, a technology of a complete set of tools, applied in the direction of computing, electrical components, electrical equipment construction parts, etc.

Active Publication Date: 2022-05-17
MICRON TECH INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, there are at least two problems associated with higher air velocities

Method used

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  • Enhanced cooling kit for components of a computing device and related systems and methods
  • Enhanced cooling kit for components of a computing device and related systems and methods
  • Enhanced cooling kit for components of a computing device and related systems and methods

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Embodiment Construction

[0017] The illustrations presented in this disclosure are not intended as actual views of any particular computing device or components thereof, but are merely idealized representations used to describe illustrative embodiments. Accordingly, the drawings are not necessarily drawn to scale.

[0018] The disclosed embodiments generally relate to configurations of ducts that better direct at least a portion of a cooling fluid (eg, air) that flows adjacent to and around heat generating components, that better directs The other part of the cooling fluid flows over the tube itself, and may optionally achieve conductive transfer of heat from the heat generating component. More specifically, embodiments of a duct assembly for a computing device are disclosed, which may include a plurality of ducts, one duct proximate to a heat generating component and another duct surrounding a first duct, the plurality of ducts The conduit may be formed from a material with high thermal conductivity...

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Abstract

The present application relates to enhanced cooling kits for components of computing devices and related systems and methods. A kit for cooling a computing device can include at least one heat generating component and a fan. The first duct may be sized and shaped to surround the at least one heat generating component on three sides to direct a portion of the air flow from the fan. A second duct may be sized and shaped to extend over the first duct and direct another portion of the air flow between the first duct and the second duct. The at least one heat generating component may include a plurality of vertically and longitudinally aligned memory modules. Computing devices, electronic systems, and cooling methods are also disclosed.

Description

[0001] priority claim [0002] This application asserts the filing date of U.S. Provisional Patent Application Serial No. 16 / 174,810, filed October 30, 2018, for "KIT FOR ENHANCED COOLING OF COMPONENTS FOR COMPUTING DEVICES AND RELATED COMPUTING DEVICES, SYSTEMS, AND METHODS" rights and interests. technical field [0003] The present disclosure generally relates to devices, systems, structures, kits, methods and techniques for enhanced cooling of computing devices and components thereof. More specifically, the disclosed embodiments relate to configurations of conduits that better direct at least a portion of the cooling fluid to flow around heat generating electronic components and other portions of the cooling fluid to flow around the heat generating electronic components. The pipes flow over themselves, and conductive transfer of heat from the heat generating component can optionally be achieved. Background technique [0004] Components of computing devices that consume...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G06F1/20
CPCG06F1/20H05K7/20145H05K7/20154H05K7/20172
Inventor 曲小鹏全炫锡
Owner MICRON TECH INC