Resonant Cavity Structures and Semiconductor Processing Equipment
A resonant cavity and resonant cavity technology, applied in circuits, discharge tubes, electrical components, etc., can solve problems such as the inability to effectively ensure the effective sealing of the elastic electromagnetic shielding ring, mechanical interference in the removal of the resonant cavity, and the failure of the elastic electromagnetic shielding ring. , to shorten the opening time, improve the opening efficiency, and improve the service life.
Active Publication Date: 2022-05-27
BEIJING NAURA MICROELECTRONICS EQUIP CO LTD
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Problems solved by technology
[0003] However, in the above structure, every time the resonant cavity needs to be opened for maintenance, it is necessary to remove the protective shell in advance, then remove the screws, and finally dismantle the resonant cavity
In addition, the screw removal space is relatively narrow, and the removal of the resonant cavity may also have mechanical interference
[0004] In addition, when the resonant cavity is closed, the effective sealing of the elastic electromagnetic shielding ring cannot be effectively guaranteed only by the action of the screw, resulting in the failure of the elastic electromagnetic shielding ring between the resonant cavity and the vacuum cavity
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[0062] Specific embodiments of the present invention will be described in detail below in conjunction with the accompanying drawings. It should be understood that the specific embodiments described here are only used to illustrate and explain the present invention, and are not intended to limit the present invention.
[0063] like Figure 1 to Figure 3 As shown, the first aspect of the present invention relates to a resonant cavity structure 100 , the resonant cavity structure 100 includes a resonant cavity body 110 , a protective shell 120 , a first support 130 , a second support 140 and a positioning member 150 . Wherein, the protective casing 120 is disposed outside the resonant cavity 110 . The first supporting member 130 is fixedly connected to the inner wall of the protective housing 120 . The second support 140 is fixedly connected to the outer wall of the resonant cavity 110, the second support 140 is located above the first support 130, and can overlap with the firs...
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The invention discloses a resonant cavity structure and semiconductor processing equipment. Including: a resonant cavity; a protective shell, which is covered outside the resonant cavity; a first support, which is fixedly connected to the inner wall of the protective shell; a second support, which is fixedly connected to the outer wall of the resonant cavity, and is located on the first support above, and can overlap with the first support, so as to be driven up and down by the first support; the positioning member, along the lifting direction of the second support, runs through the first support and the second support at the same time, so as to position the second support A support and a second support. In this way, in the process of opening the cover, the first support can be brought into contact with the second support by lifting the protective shell, so that the second support can rise under the drive of the first support, thereby driving the resonant cavity The body is separated from the vacuum cavity, which can realize the rapid opening of the resonant cavity, improve the uncapping efficiency of the resonant cavity, and shorten the uncapping time.
Description
technical field [0001] The invention relates to the technical field of semiconductor manufacturing, in particular to a resonant cavity structure and a semiconductor processing device. Background technique [0002] Generally, a surface wave plasma processing device includes a reaction chamber, a vacuum chamber, a resonant chamber and a protective shell. The resonant cavity is fixed on the top of the vacuum cavity by screws, the resonant cavity is covered with a protective shell, and the protective shell is connected with the reaction cavity. Elastic electromagnetic shielding rings are arranged between the resonant cavity and the vacuum cavity, and between the protective shell and the reaction cavity. [0003] However, in the above structure, every time the resonant cavity needs to be opened for maintenance, it is necessary to remove the protective case in advance, then remove the screws, and finally dismantle the resonant cavity. In addition, the space for screw removal is ...
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IPC IPC(8): H01J37/32
CPCH01J37/32431H01J37/32623
Inventor 段辰玥
Owner BEIJING NAURA MICROELECTRONICS EQUIP CO LTD