Method and device for starting semiconductor equipment control system

A technology for starting device and equipment control

Active Publication Date: 2021-07-09
BEIJING NAURA MICROELECTRONICS EQUIP CO LTD
View PDF12 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] In order to control each execution unit, the lower computer must first start the driver software. However, the lower computer software often fails to start, resulting in the failure of the entire semiconductor device to operate normally, and the location and cause of the failure cannot be checked.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Method and device for starting semiconductor equipment control system
  • Method and device for starting semiconductor equipment control system
  • Method and device for starting semiconductor equipment control system

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0033] Specific embodiments of the present invention will be described in detail below in conjunction with the accompanying drawings. It should be understood that the specific embodiments described here are only used to illustrate and explain the present invention, and are not intended to limit the present invention.

[0034] The inventors of the present invention found that in the related art, the start-up method of the control system of semiconductor equipment is as follows: figure 1 Shown:

[0035] In step S1, it is judged whether there are unscanned execution units;

[0036] When there is no unscanned execution unit, in step S21, continue to analyze the configuration files corresponding to other parts of the semiconductor device; and in step S31, start the control system, and start the end;

[0037] When there is an unscanned execution unit, the unscanned execution unit is scanned, and in step S22, it is judged whether the execution unit is successfully scanned;

[0038...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

No PUM Login to view more

Abstract

The present invention provides a method for starting a semiconductor device control system. The semiconductor device includes multiple execution units. The method includes: sequentially scanning the multiple execution units; when scanning the current execution unit is successful, continue to scan the next execution unit the execution unit; when scanning the current execution unit fails, record the failure information, and continue to scan the next execution unit; after scanning the multiple execution units, start the control system. The invention also provides a starting device. Using the starting method to start the semiconductor device control system can ensure the normal operation of the semiconductor device.

Description

technical field [0001] The present invention relates to the field of semiconductor equipment, in particular to a method and device for starting a semiconductor equipment control system. Background technique [0002] Semiconductor equipment usually includes an upper computer, a lower computer, and multiple execution units (execution units such as manipulators and cold pumps). The operator communicates with the lower computer through the upper computer, and the lower computer can communicate with each execution unit to control each execution unit to perform various operations. [0003] In order to control each execution unit, the lower computer must first start the driver software. However, the lower computer software often fails to start, resulting in the failure of the entire semiconductor device to operate normally, and the location and cause of the failure cannot be checked. [0004] Therefore, how to ensure the normal operation of the semiconductor equipment, and how to ...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
Patent Type & Authority Patents(China)
IPC IPC(8): G05B19/042
CPCG05B19/0423G05B2219/25257
Inventor 曹光英
Owner BEIJING NAURA MICROELECTRONICS EQUIP CO LTD
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap