A hole pattern electroplating method for fpc

A graphic electroplating and partial plating technology, which is applied in the manufacture of printed circuits, electrical components, printed circuits, etc., to achieve the effects of reducing height, improving the yield rate of circuit production, and improving the effect of poor clamping film

Active Publication Date: 2021-03-09
XIAMEN HONGXIN ELECTRON TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] In view of this, the present inventor has deeply conceived many deficiencies and inconveniences caused by the imperfection of the existing FPC hole partial pattern electroplating method, and actively researched and improved the trial production and developed and designed the present invention

Method used

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  • A hole pattern electroplating method for fpc
  • A hole pattern electroplating method for fpc
  • A hole pattern electroplating method for fpc

Examples

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Embodiment Construction

[0026] In order to further explain the technical solution of the present invention, the present invention will be described in detail below through specific examples.

[0027] Such as Figure 4 to Figure 7 Shown, the present invention is a kind of hole pattern electroplating method of FPC, and its technological process comprises the following steps:

[0028] Step A: Laminating the dry film on the substrate, and laminating the dry film on both sides of the top and bottom layers of the substrate 2 to be partially copper-plated;

[0029] Step B: Partial exposure. Expose the top and bottom layers of the substrate 2 obtained in step A, and transfer the exposure of the partial dry film pattern 20 of the unit hole to the top and bottom dry films corresponding to all FPC unit product areas in the substrate 2. The FPC unit product The area 22 of jigsaw waste outside 21 is not exposed;

[0030] Step C: Partial development, developing the substrate 2 obtained in step B to form a local ...

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Abstract

The invention discloses a hole pattern electroplating method for FPC, which comprises the following steps: pressing a dry film on a substrate, pressing the dry film on both sides of the top and bottom layers of the substrate to be partially copper-plated; partial exposure; partial development, to obtain The base plate is developed and formed to form the top and bottom unit holes and the dry film pattern is partially plated, and the base copper is exposed in the jigsaw waste area outside the FPC unit product; local copper plating is carried out on the base plate. At the same time, copper is plated on the substrate; stripping the substrate to remove the dry film on the top and bottom layers. The invention expands the electroplating area of ​​the product from the original small hole local electroplating area to the sum of the hole local electroplating area and the panel waste area, greatly improving the electroplating area of ​​the substrate, and copper plating on the product through hole At the same time, copper is also plated on the panel waste, which can disperse the plating density of the product, effectively reduce the height of the annular ring of the via hole, improve the poor film clamping of the annular ring, reduce the residue of dry film, and improve the yield rate of circuit production.

Description

technical field [0001] The invention relates to the technical field of manufacturing a flexible circuit board (FPC), in particular to a hole pattern electroplating method for an FPC. Background technique [0002] An important process in the production process of flexible circuit board FPC is hole metallization. Through metallization of via holes, the multi-layer lines of flexible circuit board FPC can be electrically connected. Conventional flexible circuit boards use copper plating on the entire board. When the hole is plated with copper, the surface of the product board is also plated with a layer of copper on the basis of the original base copper, and the copper on the product surface increases. The requirements of conventional flexible circuit board lines are different and can be met; if there are requirements for fine lines or impedance FPC products require that the copper on the surface of the product be within a certain thickness. Except for the copper plating on the ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K3/42
CPCH05K3/42H05K3/423
Inventor 蔡合汉续振林周健强
Owner XIAMEN HONGXIN ELECTRON TECH
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