431results about How to "Improve the excellent rate" patented technology

The invention is applicable to the technical field of touch screen production and provides a method for manufacturing a novel electrode lead capacitive screen, the novel electrode lead capacitive screen and a touch screen terminal. The method comprises the following steps of: (1) preparing an indium tin oxide (ITO) conductive film on a polyester (PET) base film; (2) preparing a copper film on the ITO conductive film by using a magnetically-controlled splutter coating method; (3) manufacturing ITO patterns, and forming an edge copper electrode lead at one time; (4) selectively etching the copper film on the middle ITO pattern, and reserving the ITO pattern to obtain PET thin film structures; and (5) sequentially adhering two PET thin film structures which are obtained in the step (4) and a piece of panel glass by using an optical adhesive to obtain the novel electrode lead capacitive screen. In the method for manufacturing the novel electrode lead capacitive screen provided by the invention, the magnetically-controlled splutter coating method is adopted to replace a silk-screening silver paste process to manufacture an electrode lead of a capacitive screen with mature technical means; and by the method, the good rate for manufacturing the capacitive screen having a film-film structure can be greatly improved, so that the manufacturing cost of the capacitive screen is saved.

The invention discloses a method for local tinning to the bonding pad on a circuit substrate, which enables lead-free tin plasma to be brushed to the spot welding position bonding pad of the circuit substrate through a steel mesh; the circuit substrate brushed with the lead-free tin plasma passes through the five areas of a reflow soldering machine for operating parameters in sequence, to form liquid tin coating covered in the entire spot welding position bonding pad, and after the circuit substrate cools, solid tin coating is formed in the spot welding position bonding pad. The invention utilizes the steel mesh to brush the lead-free tin plasma to the bonding pad of a common substrate, and utilizes the reflow soldering machine and depends on the wetting property of soldering flux, and the diffusion and the self positioning effect of the tin plasma to accomplish the tinning process of the bonding pad, the tin coating meets the process requirements of the thickness and the smoothness, and provides good basic conditions for the subsequent spot welding working procedure, and the manufacturer does not require to purchase special substrates for the substrate supplier, therefore, the production efficiency can be greatly improved, the qualified rate of the product can be increased, and the production cost of the enterprise can be reduced.

The invention provides a semi-transmission and semi-reflection color-film substrate and a manufacturing method thereof as well as a liquid crystal display device. The semi-transmission and semi-reflection color-film substrate is arranged in a notch of a black matrix on a transparent substrate and is provided with a plurality of color filters for presenting different primary colors, wherein backward exposure is carried out from a direction of the bottom of the transparent substrate to finally manufacture a first color filter which is made of negative photosensitive resin; and in front of the first color filter, forward mask exposure is carried out from a top direction of the transparent substrate to generate other color filters which are made of positive photosensitive resin, so that a picture layer which can be generated by two times of the forward mask exposure in the prior art can be realized through one time of the backward exposure; and therefore, a production process of the semi-transmission and semi-reflection color-film substrate is simplified and the product yield is effectively improved.

The invention discloses a production method for a sapphire pattern substrate, comprising the following particular steps of (1) depositing a layer of thin film on the upper surface of a sapphire which has a low refractive index material and 1AA-999AA thickness; (2) preparing a mask pattern on the thin film with photoresistance; (3) transferring the pattern masked with photoresist to the thin film through etching to obtain a protuberance with the 1AA-999AA thickness, wherein the lower substrate of the pattern of the protuberance has a width of 0.5-3 mu m and a gap of 0.5-3 mu m; and (4) cleaning the sapphire to remove the residual photoresistance. The invention has the advantages that PSS cost can be greatly reduced and total reflection angles are increased for light, thereby being more favorable for emergent light, improving emergent light efficiency, being favor of laser peeling and increasing excellent rate of the finished product LED chip.

The invention relates to a rare-earth electrode slurry of rare-earth circuit, based on the metal base board and a relative production, wherein it is characterized in that: said slurry is formed by solid material and organic solvent carrier, while their mass ratio is 70-90:30-10; the solid component comprises: silver, palladium, and yttrium composite power and micro-crystal glass powder, while their mass percentage is 99.4-94:0.6-6; said composite power is formed by silver, palladium, and yttrium powders at the ratio as 0.6-10:99-82:0.4-8; said micro-crystal glass is the one in SiO2-Al2O3-CaO-B2O3-Bi2O3-La2O3 group. And the production comprises: (1), preparing rare-earth micro-crystal glass powder; (2), preparing silver, palladium, and yttrium composite powder; (3), preparing organic solvent carrier; (4), mixing material in three-dimension and rolling with three rollers; (5), preparing the rare-earth slurry; (6), bottling. The invention is environment friendly and better humidity compatibility.

The invention relates to a method for manufacturing an inverted LED chip, which comprises the following steps of: forming a light reflection layer on the surface of a P type ohmic contact layer; forming an N type electrode forming region; forming an insulating medium film; forming a P type electrode region and an N type electrode region; forming a P type electrode and an N type electrode, wherein the N type electrode is of a step structure, the lower end of the N type electrode passes through the insulating medium film to be connected with the N type layer, the upper end of the N type electrode is extended to the P type electrode, and the N type electrodes at the upper end have common soldering surface of the same height or similar height; and fixing the P type electrode and the N type electrode to the respective PCB (Printed Circuit Board) boards in a soldering way. The common soldering surface of the same height or similar height is defined for the N type electrodes of the inverted LED chip in the method, so that the packaging yield of the LED inversion technology is increased and the pseudo soldering or unsoldering situation of the electrodes is avoided.

The invention discloses a method for controlling laser welding. The method comprises the following steps that 1, the weld seam width w of a workpiece to be welded is measured; 2, the locus of laser welding is controlled as x0=x1+delta*cos beta, y0=y1+delta*sin beta, x=x0+R*cos alpha, y=y0+R*sin alpha, wherein w=2R+phi, x0 and y0 serve as coordinates of a point on a straight line, x1 and y1 serve as starting point coordinates of the straight line, delta serves as a point distance of the straight line, beta serves as an inclination angle of the straight line, R serves as a shaking radius, alpha serves as a polar angle, x and y serve as coordinates of a point on a circle (that is a helical line locus), phi serves as a welding point diameter, and delta is smaller than phi. According to the method for controlling laser welding, the locus of a welding helical line is adjusted by adjusting the shaking radius and the point distance for changes of the weld seam width, therefore, a molten pool can flow more fully, the problems of weld seam depression, undercut, point burst and needle holes which are brought by traditional laser welding can be effectively solved, the welding performance is improved, and the quality rate of products is improved.

The invention discloses a thin film transistor array substrate. In a thin film transistor of the array substrate, the material of an active layer is a metal oxide semiconductor material, an etching barrier layer is also arranged on the active layer, the etching barrier layer covers a channel region, and a light shielding layer is also arranged on the etching barrier layer. The method for preparing the abovementioned thin film transistor array substrate includes preparing and obtaining the etching barrier layer and the light shielding layer in a same photomask process. In addition, the invention also discloses a display device including the abovementioned thin film transistor array substrate. In the thin film transistor array substrate provided by the invention, through additional arrangement of the light shielding layer, influence of illumination on the active layer of the thin film transistor in a manufacture process is avoided, and the problems of threshold voltage drifting and electrical property failure of the thin film transistor due to illumination influence are prevented, thereby improving product quality.

The invention discloses an automatic steel casing cutting device with a positioning function. The automatic steel casing cutting device with the positioning function comprises a work table and a carrier plate, and is characterized by further comprising a material stirring mechanism, a material overlapping induction mechanism, a cutting mechanism and a position limiting mechanism, wherein a slide rail used for material feeding of a steel casing material belt is arranged on the work table, the material overlapping induction mechanism is arranged at the rear of the work table and above the steel casing material belt, the material stirring mechanism which drives the steel casing material belt to advance is arranged at the front end of the material overlapping induction mechanism, the cutting mechanism is arranged at the front end of the material stirring mechanism, and the carrier plate is arranged beside the cutting mechanism. The automatic steel casing cutting device with the positioning function is simple in structure, convenient to use, high in machining precision and convenient in material feeding, can rapidly locate the material belt and the carrier plate, and facilitates induction of material overlapping of the material belt, and then can send an alarm.

The invention provides an external bag opening shaping method of an automatic vacuum packaging machine for tea and an apparatus thereof. The apparatus comprises an empty external bag absorbing and sending mechanism, which is capable of reciprocating between an empty external bag holding device and an empty external bag expanding mechanism and is provided with a bag-fetching sucker holder with a bag-fetching sucker; a through groove is arranged at the middle of the top surface of the bag-fetching sucker holder; the bag-fetching sucker is installed on the bottom surface of the groove; the opposite sides of two side walls of the groove are correspondingly provided with a shaping and blowing opening; the bag-fetching sucker holder is provided with an air inlet for connecting an external air source and an air passage for communicating with the shaping and blowing opening and the air inlet. After the empty external bag is charged, in the process that the bag expanding sucker and the bag-fetching sucker are close to each other again, the shaping and blowing opening aims at the middle part of the foldable side of the empty external bag and blows continuously; the continuous blowing forcibly makes the middle part of the foldable side of the empty external bag fold inwards and ensures that the external bag opening recovers the folded shape of the side after the bag expanding sucker and the bag-fetching sucker are compacted with each other. The invention has the advantages of simple structure, reliable work, automatic shaping of the external bag opening and improvement of the excellent rate of the finished product to the maximum.

The manufacture of flash memory includes providing a prefabricated semiconductor substrate with tunnel oxide layer and the first conductor layer on the oxide layer; removing partial first conductor layer to make the separating part in the shallow ditch higher than the first conductor layer; depositing one dielectric layer and etchbacking in the first conductor layer to form spacer as etching shield and etching the first conductor layer to form one channel; removing partial shallow ditch isolation to expose the outer side of the ditch; removing the spacer to form one floating gate; depositing a thin dielectric layer and the second conductor layer; and making pattern in the second conductor layer of form control gate.

The invention relates to a manufacturing method of a uniform temperature plate, the steps of which is that: first, a plurality of heat pipes, a first plate body and a second plate body are prepared, wherein, a plurality of covers which is recessed into the end face of the second plate body and extruded from the superface of the second plate body are punch formed on the second plate body; a recess area formed by various covers is provided with cambered spaces which can hold the heat pipes horizontally; second, the heat pipes are respectively arranged in the cambered spaces; the first plate body is attached on the end face of the second plate body to make the two plate bodies overlapped up and down; third, an external force is applied on the second plate body for a compact surface contact formed in the extruding direction by the heat pipes and the corresponding cambered spaces of the heat pipes.

A method for preparing the product of the soft metal difficult to machine, such as Mg-alloy or MgAl-alloy, features a vacuum sputtering method is used for modifying the surface of said product. Said Mg-alloy product has high surface quality.

A method for integrally forming the foamed shoe body includes such steps as putting an upper assembly and a sole unit with foamed insole in a die, introducing the heat flow in the circulating channel in the die for raising its temp. and hot pressing. Its advantages are low cost and high productivity.

The invention discloses a long bone fracture repositioning device, which comprises a proximal end support frame, a distal end support frame, quick drawing extension rods, steel needle fixing clamps and steel needles, wherein the quick drawing extension rods are connected between the proximal end support frame and the distal end support frame, the steel needle fixing clamps are connected to the proximal end support frame and the distal end support frame, the steel needles are clamped by the steel needle fixing clamps, the proximal end support frame and the distal end support frame are same in structure and respectively comprise a transverse chute type repositioning slide plate and two fixed gliding hole plates which are connected to the chute type repositioning slide plate, one surface of each chute type repositioning slide plate is provided with a transverse guide sliding chute, a transverse guide long hole is formed between the bottom of the guide sliding chute and the other surface of the chute type repositioning slide plate, the fixed gliding hole plates are provided with holes for connecting the steel needle fixing clamps, the fixed gliding hole plates are further provided with positioning bulges which are matched with the guide sliding chutes and can slide along the guide sliding chutes. The long bone fracture repositioning device disclosed by the invention is simple in structure, the minimally invasive idea is enhanced, the excellent rate of repositioning is improved, and requirements of fracture repositioning and various malformation correcting can be met to the maximum extent.

The invention relates to an error-detecting method for testing the state of a data-processing device starting and entering an operating system and setting standard configuration information, standard startup time and a test number so that the data-processing device executes startup operation according to the test number. The data-processing device starts up and enters the operating system, calculates and displays the startup number of the data-processing device, calls an information-collecting program loaded on the operating system so as to sense various hardware parts on the data-processing device and collect configuration information which corresponds to the hardware parts while calculating consumed time for the data-processing device to start and enter the operating system so as to respectively compare the collected configuration information of the hardware parts with the standard configuration information and compare the calculated consumed time with the standard startup time to judge and record whether the startup process has errors.

The invention relates to a blanking-type packaging structure without outer pins and a manufacturing method thereof. The manufacturing method of the blanking-type packaging structure without outer pins comprises the following steps: providing a lead frame with a plurality of carrier units, wherein each carrier unit internally forms a plurality of pins, disposing a plurality of wafers to the lead frame, wherein the wafers are electrically connected to the pins, forming a plurality of glue sealing bodies on the carrier units and combining the pins, performing one step of semi-blanking to form a plurality of half-concave nicks on the pins along the outer periphery of the glue sealing bodies, performing one step of electric plating to form an electric plating layer on the exposed surface of the half-concave nicks of the pins and performing one step of complete plating for cutting off the pins along the half-concave nicks to be divided into individual glue sealing bodies. The invention can resolve the problems that the pins of the blanking-type packaging structure without outer pins are torn off, dropped down with rough edges and the like in the single planking process, and the invention can increase the excellent rate of the process and even increase the plating area of the pins, thereby being quite suitable for utility.

The invention discloses a feeding mechanism of a roller pair cutting machine. The feeding mechanism of the roller pair cutting machine comprises a frame, a cutting mechanism, an U-shaped frame, a topplate, a second cylinder, a slide block, a first rotating shaft, an upper guide roller, a second rotating shaft, a lower guide roller, a driven wheel, a belt, a driving wheel, a motor, a transition plate, a spring roller, an emptying frame, a support block, an emptying roller, a bracket, a collecting table, a through hole and a fixed block; the cutting mechanism is arranged at the upper end of theframe; the cutting mechanism comprises a support base, a cross beam, a first cylinder, a mounting plate, a cutter mold and a protective cover; through extension of the second cylinder, the slide block is driven to slide on the inner wall of the U-shaped frame up and down to drive the upper guide roller to move up and down; according to the material thickness, the upper guide roller is adjusted toa proper position for coacting with the lower guide roller to press materials; and through structural arrangement, the cutting machine can adjust the pressing gap according to the material thicknessto effectively prevent indentation and wear of the materials so as to improve the product yield.