Method for preparing samming board

Abstract

The invention relates to a manufacturing method of a uniform temperature plate, the steps of which is that: first, a plurality of heat pipes, a first plate body and a second plate body are prepared, wherein, a plurality of covers which is recessed into the end face of the second plate body and extruded from the superface of the second plate body are punch formed on the second plate body; a recess area formed by various covers is provided with cambered spaces which can hold the heat pipes horizontally; second, the heat pipes are respectively arranged in the cambered spaces; the first plate body is attached on the end face of the second plate body to make the two plate bodies overlapped up and down; third, an external force is applied on the second plate body for a compact surface contact formed in the extruding direction by the heat pipes and the corresponding cambered spaces of the heat pipes.

Description

technical field [0001] The invention relates to a method for manufacturing a vapor chamber, in particular to a manufacturing method of a vapor chamber that utilizes two plate bodies to clamp a plurality of heat pipes, and through pressing, the two plate bodies and the heat pipes are combined more tightly. method. Background technique [0002] In the prior art, there is a "manufacturing method of a heat sink heat pipe", which discloses a method that "includes processing the heat sink to set a plurality of heat conduction channels that are not connected at the ends; The process of sealing the open end and retaining at least one open end; simultaneously filling the working fluid and vacuuming the process from the retained open end, and then sealing it” method. Its purpose is mainly to use the material (such as copper and aluminum) with better thermal conductivity of the cooling plate, cooperate with the so-called processing method to form a heat conduction channel, and implant...

AI Technical Summary

Problems solved by technology

Regardless of whether the heat dissipation plate heat pipe formed by the above-mentioned prior art can effectively achieve the above-mentioned heat dissipation effect, there are difficulties in practical operation in this processing procedure.

First of all, the cooling plate has to face the processing process of the heat conduction channel, and the precision must be paid attention to

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