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A fan-out packaging method and a fan-out packaging device

A packaging method and technology for packaging devices, which are applied in the manufacturing of semiconductor devices, electric solid-state devices, and semiconductor/solid-state devices, etc., can solve problems such as flying deflection and chip offset, reduce product costs, improve structural stability and package products. the quality of the effect

Active Publication Date: 2022-02-11
NANTONG TONGFU MICROELECTRONICS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The inventors of the present application have discovered in the long-term research process that problems such as chip offset and fly-away will occur in the above-mentioned press-forming process

Method used

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  • A fan-out packaging method and a fan-out packaging device
  • A fan-out packaging method and a fan-out packaging device
  • A fan-out packaging method and a fan-out packaging device

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Embodiment Construction

[0029] The following will clearly and completely describe the technical solutions in the embodiments of the present application with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only some of the embodiments of the present application, not all of them. Based on the embodiments in this application, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the scope of protection of this application.

[0030] see figure 1 , figure 1 It is a schematic flow chart of an implementation mode of the fan-out packaging method of the present application, and the fan-out packaging method includes:

[0031] S101 : attach one end of the metal post 14 to the carrier 20 , wherein the metal post 14 is located on the functional surface 1002 of the chip 100 and is electrically connected to the pad 1000 on the functional surface 1002 of the chip 100 .

[0032] In one implem...

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PUM

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Abstract

The present application provides a fan-out packaging method and a fan-out packaging device. The packaging method includes: attaching one end of a metal post to a carrier plate, wherein the metal post is located on the functional surface of the chip, and It is electrically connected to the pad on the functional surface of the chip; an underfill glue is formed between the functional surface of the chip and the carrier, and the underfill glue covers the metal pillar; A plastic sealing layer is formed on the side of the carrier plate provided with the chip, and the plastic sealing layer covers the chip and the underfill glue; the carrier plate is removed. Through the above method, the present application can use the underfill glue to fix the chip, thereby reducing the probability of chip offset and flying deviation during the pressing and molding process.

Description

technical field [0001] The present application relates to the technical field of semiconductors, in particular to a fan-out packaging method and a fan-out packaging device. Background technique [0002] The existing fan-out packaging method for forming six-sided protection includes: using a die bonding process to stick the non-functional surfaces of multiple chips on the carrier; sealing the carrier with a molding compound, and pressing it into shape, To form a five-sided protected fan-out packaging device; remove the carrier plate, and use an adhesive film to stick the non-functional surface of the chip to form a six-sided protected fan-out packaged device. [0003] The inventors of the present application have discovered in the course of long-term research that problems such as chip offset and fly-out may occur in the above-mentioned press molding process. Contents of the invention [0004] The technical problem mainly solved by this application is to provide a fan-out ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/56H01L23/31H01L21/60
CPCH01L21/568H01L23/3107H01L24/02H01L2224/02379H01L2224/18H01L2224/73204H01L2224/92125
Inventor 王耀尘李尚轩石佩佩
Owner NANTONG TONGFU MICROELECTRONICS CO LTD