Processing device and method for removing protective layer by laser

A processing device and protective layer technology, applied in laser welding equipment, metal processing equipment, manufacturing tools, etc., can solve the problems of inaccurate positioning, high processing cost, and low degree of automation, so as to improve production efficiency, ensure consistency, The effect of improving the yield rate

Inactive Publication Date: 2020-07-03
HANS LASER TECH IND GRP CO LTD
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0004] The technical problem to be solved by the present invention is to provide a laser processing device and method for removing the protective layer in view of the above-mentioned defects of the prior art, aiming at solving the problems of inaccurate positioning, high processing cost and low degree of automation in the prior art The problem

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  • Processing device and method for removing protective layer by laser
  • Processing device and method for removing protective layer by laser
  • Processing device and method for removing protective layer by laser

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Embodiment Construction

[0047] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by those skilled in the technical field of the application; the terms used herein in the description of the application are only for the purpose of describing specific embodiments , is not intended to limit the present application; the terms "comprising" and "having" and any variations thereof in the description and claims of the present application and the description of the above drawings are intended to cover non-exclusive inclusion. The terms "first", "second" and the like in the description and claims of the present application or the above drawings are used to distinguish different objects, rather than to describe a specific order.

[0048] Reference herein to an "embodiment" means that a particular feature, structure, or characteristic described in connection with the embodiment can be included in at least one embodiment of the present application....

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Abstract

The invention discloses a processing device and method for removing a protective layer by laser. The processing device comprises a machine base, a transmission assembly, a laser unit, upper and loweroptical splitters and a laser reflecting mechanism, wherein the transmission assembly is arranged on the machine base, a jig mechanism is arranged on the transmission assembly; the transmission assembly is used for conveying the jig mechanism into a processing station; the laser unit is used for emitting laser; the upper and lower optical splitters which are separately the upper optical splitter and the lower optical splitter are arranged at a light outlet part of the laser unit for dividing laser emitted by the laser unit into upper and lower paths; the laser reflecting mechanism comprises anupper reflecting mechanism and a lower reflecting mechanism, the upper reflecting mechanism is arranged at the light outlet part of the upper optical splitter, and the lower reflecting mechanism is arranged at the light outlet part of the lower optical splitter; and the processing station is arranged between an optical path of the upper reflecting mechanism and an optical path of the lower reflecting mechanism. The processing device can improve production efficiency, also improves the yield of product labeling, and guarantees consistency of product labeling effect.

Description

technical field [0001] The invention relates to the technical field of laser processing, in particular to a processing device and method for removing a protective layer by laser. Background technique [0002] Now the use of laser equipment is in continuous development. Laser processing technology is a technology that uses the characteristics of the interaction between laser beams and substances to cut, weld, surface treat, drill, micromachining, and act as a light source to identify objects. , the largest field of traditional application is laser processing technology. During processing, it is mainly used to remove the surface film layer or mark the effect. Existing laser processing equipment for removing thin films or coatings measures the thickness of thin films or coatings in real time, and adjusts laser parameters according to the thickness to achieve the optimal removal effect, fast and accurate. [0003] However, the above-mentioned technology is too simple to remove...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K26/067B23K26/36
CPCB23K26/36B23K26/0673
Inventor 曹洪涛刘亮郭缙刘康杨柯吕启涛高云峰
Owner HANS LASER TECH IND GRP CO LTD
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