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Integrated circuit test module and preparation method thereof

A technology for testing modules and integrated circuits, applied in circuits, semiconductor/solid-state device testing/measurement, electrical components, etc., can solve problems such as short service life, complex mechanism, and high processing difficulty

Pending Publication Date: 2020-07-10
UNIVERSAL GLOBAL TECH KUNSHAN
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0003] The traditional integrated circuit test module mainly uses the elastic contact of the probe to achieve the purpose of multiple tests. However, the probe has the disadvantages of high maintenance cost, complex mechanism, high processing difficulty, short service life and fast electrical decay. Cause troubles in maintenance cost considerations

Method used

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  • Integrated circuit test module and preparation method thereof
  • Integrated circuit test module and preparation method thereof
  • Integrated circuit test module and preparation method thereof

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Embodiment Construction

[0036] Embodiments of the present invention will be described below with reference to the drawings. For the sake of clarity, many practical details are included in the following narrative. However, the reader should understand that these practical details should not be used to limit the present invention. That is, in some embodiments of the present invention, these practical details are unnecessary. In addition, for the sake of simplifying the drawings, some existing conventional structures and elements will be shown in a simple schematic way in the drawings; and repeated elements may be denoted by the same numerals.

[0037] Please refer to figure 1 , Figure 2A , Figure 2B , Figure 2C as well as Figure 2D ,in figure 1 It is a flowchart showing the steps of a method 100 for manufacturing an integrated circuit test module according to an embodiment of the present invention. Figure 2A , Figure 2B , Figure 2C as well as Figure 2D show respectively according to ...

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Abstract

The invention provides an integrated circuit test module and a preparation method thereof. The integrated circuit test module comprises a test circuit board and an elastic structure. The test circuitboard comprises a plurality of contacts. The elastic structure is arranged on the test circuit board; the elastic structure comprises a plurality of probe groups and an elastic rubber block; each probe set comprises a first metal ball, a second metal ball and a metal wire, the metal wires are connected between the first metal balls and the second metal balls, the second metal ball is electricallyconnected to the contacts, the probe sets are vertically and partially wrapped in the elastic rubber block, and the first metal balls are used for being electrically contacted with an element to be tested. Therefore, the conventional double-head probe can be replaced by the elastic structure with the elastic rubber block and the probe group, so that the manufacturing and maintenance cost of the double-head probe is reduced.

Description

technical field [0001] The invention relates to an integrated circuit test module and a preparation method thereof, in particular to an integrated circuit test module using double metal balls instead of probes and a preparation method thereof. Background technique [0002] In the manufacturing process of integrated circuits or chips, it is necessary to test the integrated circuits or chips at each process stage to determine whether they are good products or to determine their electrical properties. [0003] The traditional integrated circuit test module mainly uses the elastic contact of the probe to achieve the purpose of multiple tests. However, the probe has the disadvantages of high maintenance cost, complex mechanism, high processing difficulty, short service life and fast electrical decay. Causes troubles in maintenance cost considerations. [0004] In view of this, how to develop a probe that can replace the traditional test module to make it easy to maintain and low...

Claims

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Application Information

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IPC IPC(8): H01L21/66
CPCH01L22/34H01L22/30
Inventor 袁元
Owner UNIVERSAL GLOBAL TECH KUNSHAN
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