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A notebook computer and mainframe technology, applied in the direction of electrical digital data processing, instruments, structural components of portable computers, etc., can solve problems such as unsatisfied, high processing chip temperature, and performance decline, and achieve the goal of increasing heat dissipation space and enhancing heat dissipation efficiency Effect

Active Publication Date: 2021-11-30
ACER INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] However, when the heat dissipation airflow is insufficient, heat sources such as the processing chip in the notebook computer cannot achieve the required heat dissipation performance, resulting in an excessively high temperature of the processing chip.
At this time, in order to prevent the processing chip from being damaged, the notebook computer will reduce the operation speed of the processing chip, which will lead to the loss of performance.
[0005] According to this, while the current notebook computer is suitable for its purpose, it does not meet the requirements of many other aspects

Method used

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Embodiment Construction

[0029] The following description provides many different embodiments, or examples, for implementing various features of the invention. The elements and arrangements described in the following specific examples are only used to express the present invention in a concise manner, and are only used as examples rather than limiting the present invention. For example, a description of a first feature on or over a second feature includes direct contact between the first and second features, or another feature disposed between the first and second features such that the first It is not in direct contact with the second feature.

[0030] Spatially relative terms used herein, such as above or below, are only used to briefly describe the relationship of one element or one feature with respect to another element or feature on the drawings. This includes devices that are used or operated in different orientations than those depicted in the drawings. The shapes, dimensions, and thicknesse...

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Abstract

A notebook computer includes a host, a rotating shaft mechanism and a screen. The main engine includes a casing with a bottom surface; a lifting mechanism arranged in the casing; and a foot pad connected with the lifting mechanism and adjacent to the bottom surface. The rotating shaft mechanism is connected to the host, and includes a first pivot connected to the lifting mechanism. The screen is connected to the hinge mechanism. When the screen rotates relative to the host, the first pivot drives the lifting mechanism, so that the lifting mechanism changes the distance between the top of the foot pad and the bottom surface.

Description

technical field [0001] The invention mainly relates to a notebook computer, especially a notebook computer with a lifting mechanism linked with a rotating shaft mechanism. Background technique [0002] A common notebook computer includes a host, a screen, and a hinge mechanism. The screen rotates relative to the host through the hinge mechanism, and the screen can be tilted relative to the host through the hinge mechanism, so that users can watch the screen conveniently. [0003] Due to the thinning development of the notebook computer, the thickness of the notebook computer is getting thinner and thinner, thereby limiting the heat dissipation space in the notebook computer and the size of the heat dissipation structure and the fan. Therefore, when the notebook computer operates at a high speed, it is necessary to greatly increase the rotation speed of the fan to improve the cooling air flow inside the notebook computer. [0004] However, when the heat dissipation airflow ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G06F1/16
CPCG06F1/1616G06F1/166
Inventor 郑砚丰凌正南黄奕达张正茂黄宝民李武晟
Owner ACER INC