Packaged inductive component
A technology of inductive components and inductive elements, which is applied in the directions of encapsulation/impregnation, parts of transformer/inductor, transformer/inductor coil/winding/connection, etc. It can solve the problem of not providing a heat-conducting shell to dissipate the heat of the coil
Pending Publication Date: 2020-07-21
DELTA ELECTRONICS (THAILAND) PUBLIC CO LTD
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- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
On the downside, this electrical device does not provide a thermally conductive housing to dissipate the heat generated by the coil during its operation
Method used
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Embodiment Construction
[0094]figure 1 A packaged inductive component 1 comprising an inductive element 2 with terminal pins 3 is illustrated. An optional substrate 4 is arranged on the bottom side of the packaged inductive component 1 with two holes through which the terminal pins 3 of the inductive element 2 pass.
[0095] On the top side of the packaged inductive component 1 , which is located opposite the bottom side of the packaged inductive component 1 , a first region 10 is arranged with a first side 11 forming an outer surface of the packaged inductive component 1 . The first region 10 has the form of a round or angular plate and is made of electrically insulating and thermally conducting ceramic.
[0096] The first area 10 is in contact with the second area 6 , which in turn is in contact with the sensing element 2 via the second surface 7 . The second region 6 is made of an electrically and thermally insulating plastic. The thickness of the part of the second region 6 between the first re...
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Abstract
According to the invention, a packaged inductive component comprises an inductive element and an electrically insulating packaging enclosing the inductive element. The packaging comprises a first areaconsisting of a thermally conductive material and a second area consisting of a thermally insulating material. The first area has a first surface being an outside surface of the packaged inductive component. The outer surfaces of the packaged inductive component are free of any electrical potential. The packaged inductive component allows for improved heat dissipation. In particular, heat generated by power losses in the inductive element dissipates through the first area of the packaging to an outside surface of the packaged inductive component. This leads to an affordable packaged inductivecomponent. The inductive element can be for example an inductor or a transformer.
Description
technical field [0001] The invention relates to a packaged inductive assembly comprising an inductive element and an electrically insulating encapsulation surrounding the inductive element. The package includes a first region of thermally conductive material and a second region of thermally insulating material. [0002] The invention also relates to a method for manufacturing a packaged inductive component. Furthermore, the invention relates to a power converter comprising an encapsulated inductive component and to the use of the power converter. Background technique [0003] Packaged inductive components such as packaged inductors or packaged transformers are well known and widely used. In particular, they are used in power converters for converting power. In addition to their inductive properties, such packaged inductive components must meet other requirements such as electrical insulation and thermal conductivity in order to dissipate the heat generated in the inductiv...
Claims
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IPC IPC(8): H01F27/02H01F27/29H01F27/08H01F41/00
CPCH01F27/022H01F27/025H01F27/08H01F27/29H01F41/005H01F27/22H01F41/02H02M7/003H05K7/209
Inventor H.尼恩德R.格里格
Owner DELTA ELECTRONICS (THAILAND) PUBLIC CO LTD