Pin breakage prevention type multi-contact socket

Abstract

The present invention relates to a pin breakage prevention type multi-contact socket, and more specifically, to a pin breakage prevention type multi-contact socket which reduces a distance between a test device and probe pins of the socket for circuit connection in contact with terminals of an object to be tested and prevents a contact defect of the terminals or prevents a plate-shaped probe frombeing bent or damaged by a contact with the terminals. Further, the pin breakage prevention type multi-contact socket includes: a plurality of probe pins having a plurality of contact surfaces to be in multi-contact with the terminals; a housing having the probe pins vertically disposed therein; and mold portions disposed between the probe pins protruding to terminal insertion grooves, to which the terminals of the housing are coupled, to prevent damage to the probe pins.

Description

technical field [0001] The present invention relates to a pin damage-proof multi-contact socket, more particularly, relates to a pin damage-proof multi-contact socket, which not only reduces the size of the circuit connection detector by connecting with the terminal of the detected object The distance between the socket probes can prevent poor contact with the terminals, or the phenomenon that the plate probes are bent or damaged due to connection with the terminals. Background technique [0002] Usually, various electronic components are placed on the circuit boards that make up electronic equipment. Defects generated during the process of arranging various electronic components are identified by electrical signals after the circuit is connected to the circuit board to form a loop. [0003] In addition, not only the circuit boards of electronic equipment, but also the defects of individual components in the manufacturing process can be detected by it. [0004] For example,...

AI Technical Summary

Problems solved by technology

[0007] On the contrary, the existing cylindrical probes have the problem that it is difficult to reduce the size of the probe or shorten the distance between the probe and the probe.

[0008] Therefore, a socket using a thin-plate-shaped probe was developed, however, in the process of repeatedly inspecting multiple boards and parts using one socket, there was a problem that the thin-plate-shaped probe of the inspection socket was easily bent or damaged

[0009] Accordingly, Korean Patent No. 10-0999864 discloses "a probe block for testing liquid crystal display panels" and other methods that can facilitate the replacement of damaged plate-shaped probes, but due to the need to discard the replaced probes processing, so there is a problem of over-incurring the cost required for replacement

[0010] That is, the problem of damage to the probe itself cannot be prevented

[0011] In addition, since the contact points of plate probes are thinner than cylindrical probes, poor contact often occurs when connecting to the terminals of the object to be tested.

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