Circuit board and manufacturing method thereof

A manufacturing method and circuit board technology, which can be used in printed circuit manufacturing, multilayer circuit manufacturing, printed circuits, etc., can solve problems such as poor contact, and achieve the effect of avoiding poor contact.

Active Publication Date: 2020-12-18
HONGQISHENG PRECISION ELECTRONICS (QINHUANGDAO) CO LTD +1
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, when the circuit board with embedded circuits needs to be soldered with other electronic components in subsequent packaging or embedded circuits, since the embe

Method used

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  • Circuit board and manufacturing method thereof
  • Circuit board and manufacturing method thereof
  • Circuit board and manufacturing method thereof

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[0029] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0030] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the technical field of the invention. The terms used herein in the description of the present invention are for the purpose of describing specific embodiments only, and are not intended to limit the present invention.

[0031] Some embodiments of the present invention will be described in detail below in conju...

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Abstract

The invention relates to a manufacturing method of a circuit board. The method comprises the following steps of providing a bearing plate, and forming a first circuit layer on the surface of the bearing plate; arranging an adhesive layer in the area, exposed out of the first circuit layer, of the surface of the bearing plate, wherein the thickness of the adhesive layer is less than that of the first circuit layer; arranging wiring layers on the surfaces of the first circuit layer and the adhesive layer, wherein each wiring layer includes at least one dielectric layer and at least one second circuit layer which are arranged alternately, and the dielectric layer on the outermost side covers the first circuit layer and fills a gap, higher than the adhesive layer, of the first circuit layer; enabling the first circuit layer to be partially embedded into the dielectric layer on the outermost side; and removing the bearing plate and removing the adhesive layer so that a part of the first circuit layer convexly extends out of the surface of the dielectric layer on the outermost side. The invention further provides the circuit board.

Description

technical field [0001] The invention relates to a circuit board and a manufacturing method thereof, in particular to a circuit board for packaging and a manufacturing method thereof. Background technique [0002] In existing circuit boards, in order to reduce the volume of the circuit board, some circuit layers are usually buried in the dielectric layer. However, when the circuit board with embedded circuits needs to be soldered with other electronic components in subsequent packaging or embedded circuits, since the embedded circuits are completely embedded in the dielectric layer, the requirements for welding accuracy are often higher, and poor contact is prone to occur The phenomenon. Contents of the invention [0003] In view of this, it is necessary to provide a circuit board which is convenient to be electrically connected with other electronic components and has high reliability and a manufacturing method thereof. [0004] A method for manufacturing a circuit board...

Claims

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Application Information

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IPC IPC(8): H05K3/46H05K1/02
CPCH05K3/4682H05K1/0296H05K1/0298H05K3/0097H05K2203/1536H05K3/244H05K3/243H05K2203/308H05K2203/1105H05K2203/0376H05K2203/072H05K2203/073H05K3/38H05K3/4602
Inventor 傅志杰
Owner HONGQISHENG PRECISION ELECTRONICS (QINHUANGDAO) CO LTD
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