Circuit board and manufacturing method thereof

Abstract

The invention relates to a manufacturing method of a circuit board. The method comprises the following steps of providing a bearing plate, and forming a first circuit layer on the surface of the bearing plate; arranging an adhesive layer in the area, exposed out of the first circuit layer, of the surface of the bearing plate, wherein the thickness of the adhesive layer is less than that of the first circuit layer; arranging wiring layers on the surfaces of the first circuit layer and the adhesive layer, wherein each wiring layer includes at least one dielectric layer and at least one second circuit layer which are arranged alternately, and the dielectric layer on the outermost side covers the first circuit layer and fills a gap, higher than the adhesive layer, of the first circuit layer; enabling the first circuit layer to be partially embedded into the dielectric layer on the outermost side; and removing the bearing plate and removing the adhesive layer so that a part of the first circuit layer convexly extends out of the surface of the dielectric layer on the outermost side. The invention further provides the circuit board.

Description

technical field [0001] The invention relates to a circuit board and a manufacturing method thereof, in particular to a circuit board for packaging and a manufacturing method thereof. Background technique [0002] In existing circuit boards, in order to reduce the volume of the circuit board, some circuit layers are usually buried in the dielectric layer. However, when the circuit board with embedded circuits needs to be soldered with other electronic components in subsequent packaging or embedded circuits, since the embedded circuits are completely embedded in the dielectric layer, the requirements for welding accuracy are often higher, and poor contact is prone to occur The phenomenon. Contents of the invention [0003] In view of this, it is necessary to provide a circuit board which is convenient to be electrically connected with other electronic components and has high reliability and a manufacturing method thereof. [0004] A method for manufacturing a circuit board...

AI Technical Summary

Problems solved by technology

However, when the circuit board with embedded circuits needs to be soldered with other electronic components in subsequent packaging or embedded circuits, since the embedded circuits are completely embedded in the dielectric layer, the requirements for welding accuracy are often higher, and poor contact is prone to occur The phenomenon

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