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A die stamping damping system

A shock absorption system and mold technology, applied in the field of mold stamping shock absorption, can solve problems such as stamping process failure, stamping table vibration, mold impact, etc.

Active Publication Date: 2022-04-26
深圳市晶品精密模具有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The purpose of the present invention is to solve the problem that the stamping table is easily caused to vibrate during the impact, not only will cause the failure of the stamping process, but also there will be corresponding debris in the mold groove, which will affect the mold during stamping, and the proposed A Die Stamping Damping System

Method used

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Embodiment Construction

[0024] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention.

[0025] In describing the present invention, it should be understood that the terms "upper", "lower", "front", "rear", "left", "right", "top", "bottom", "inner", " The orientation or positional relationship indicated by "outside", etc. is based on the orientation or positional relationship shown in the drawings, and is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the referred device or element must have a specific orientation, so as to Specific orientation configurations and operations, therefore, are not to be construed as limitations on the invention.

[0026] refer to Figure ...

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Abstract

The invention discloses a die stamping shock absorbing system, which comprises a rotating table, a first hemispherical groove is opened on the top of the rotating table, a punching table is arranged above the rotating table, the punching table is ring-shaped, and the inside of the punching table A plurality of partition plates are arranged vertically, and the opposite ends of the plurality of partition plates are connected to the same stamping cylinder. A pressing plate is arranged above, a transmission device is arranged below the pressing plate, and a one-way exhaust device is arranged inside the stamping cylinder. In the present invention, the air channel is opened on the side wall of the stamping cylinder, wherein the inner space of the stamping cylinder communicates with the inner space of the turntable through the air channel, thereby achieving the effect of lifting the airflow of the mold placed in the stamping cylinder, and at the same time, the gas flows from the bottom of the stamping cylinder Blowing out by the second one-way airflow valve can also play a cleaning effect on a small amount of debris existing in the stamping cylinder.

Description

technical field [0001] The invention relates to the technical field of die stamping shock absorption, in particular to a die stamping shock absorption system. Background technique [0002] At present, during the stamping process of the mold, the mold plate can be placed above the corresponding mold groove, and then the mold plate can be punched into the mold groove through the corresponding stamping die to complete the stamping of the mold. The impact can impact the top of the stamping table, which can easily cause the stamping table to vibrate during the impact, which will cause the failure of the stamping process, and during the stamping process, there will be corresponding debris in the mold groove, which will cause damage to the mold during stamping. Impact, in which debris will adhere to the mold, affecting the surface smoothness of the mold, which in turn affects the quality of the workpiece. [0003] To this end, we have designed a die stamping damping system. Cont...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B21D37/10F16F15/023B08B5/02
CPCB21D37/10F16F15/023B08B5/02F16F2230/14
Inventor 班友江
Owner 深圳市晶品精密模具有限公司