Three-dimensional measuring device

A three-dimensional measurement and detection device technology, applied in measurement devices, optical devices, instruments, etc., can solve problems such as inability to properly install electronic components

Pending Publication Date: 2020-07-31
JUKI CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0004] In the technique of Patent Document 1, when the lead wires of the supplied electronic components vary in length, the electronic components cannot be properly mounted.

Method used

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Embodiment approach

[0022]

[0023] Embodiments will be described. figure 1 It is a figure which schematically shows an example of the electronic component mounting system 100 which concerns on an embodiment. figure 1 It is a figure which looked at the electronic component mounting system 100 from -Y direction.

[0024] Such as figure 1 As shown, the electronic component mounting system 100 includes a three-dimensional measuring device 1 and an electronic component mounting device 2 . The electronic component mounting system 100 detects the length of the lead L of the electronic component C, that is, the lead length LL (refer to figure 2 ), based on the detected wire length LL (refer to figure 2 ), the electronic component C is mounted on the substrate P by the electronic component mounting apparatus 2 . Hereinafter, first, the electronic component mounting device 2 will be described, and then the three-dimensional measuring device 1 according to the present embodiment will be described. ...

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Abstract

The invention provides a three-dimensional measuring device which can properly mount an electronic component even if the length of a wire of the supplied electronic component deviates. The three-dimensional measuring device (1) is provided with: a suction nozzle (11) that holds an electronic component (C) having a wire (L); a detection device (12) for detecting a wire length (LL) which is the length of the wire (L) of the electronic component (C) held by the suction nozzle (11). The three-dimensional measuring device (1) is further provided with a mounting condition changing unit that changesthe mounting condition of the electronic component (C) on the basis of the wire length (LL) which is the length of the wire (L) detected by the detection device (12).

Description

technical field [0001] The invention relates to a three-dimensional measuring device. Background technique [0002] Patent Document 1 discloses a technique for determining conditions for mounting an electronic component based on the length of a lead of an electronic component having a lead. [0003] Patent Document 1: Japanese Patent No. 5925510 [0004] In the technology of patent document 1, when the length of the lead wire of the supplied electronic component varies, an electronic component cannot be mounted suitably. Contents of the invention [0005] An object of an aspect of the present invention is to enable appropriate mounting of electronic components even when there is variation in the length of lead wires of supplied electronic components. [0006] According to an embodiment of the present invention, there is provided a three-dimensional measuring device including: a suction nozzle holding an electronic component having a lead wire; and a detection device dete...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G01B11/25
CPCG01B11/2513
Inventor 儿玉裕介高桥大助
Owner JUKI CORP
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