force sensor

A technology of force sensor and sensing part, applied in the field of sensors, can solve the problems of increasing the manufacturing cost of sensors, easy wear and tear, and insufficient supporting force of sensing elements

Active Publication Date: 2022-03-29
CORETRONIC MEMS CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] For the micro-electromechanical force sensor, the sensing element is used to sense the pressing force applied by the entity. If the sensing element is exposed and directly bears the pressing force, the sensing element may be easily worn out due to insufficient supporting force
If a cover is added to cover the sensing element and increase the supporting force in order to solve the above problems, the manufacturing cost of the sensor will be increased

Method used

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Embodiment Construction

[0041] figure 1 is a cross-sectional view of a force sensor according to an embodiment of the present invention. Please refer to figure 1 The force sensor 100 of this embodiment is, for example, a microelectromechanical force sensor and includes a circuit board 110 , a bonding layer 120 , a sensing element 130 , a first glue 140 , a second glue 150 and at least one welding wire 160 . The sensing element 130 has an opposite top surface 130 a and a bottom surface 130 b and has a sensing portion 131 located on the top surface 130 a. The sensing element 130 may be a piezoresistive sensing element, a capacitive sensing element or other suitable sensing elements, and the invention is not limited thereto.

[0042] The first glue 140 is disposed on the top surface 130 a of the sensing element and covers the sensing portion 131 . The sensing part 131 is adapted to cause the sensing element 130 to generate a sensing signal through the external force F transmitted from the first glue ...

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Abstract

The invention provides a force sensor including a circuit board, a sensing element and a first glue. The sensing element is arranged on the circuit board, wherein the sensing element has opposite top surface and bottom surface and has a sensing portion. The bottom side faces the circuit board. The sensing part is located on the top surface. The first colloid is arranged on the top surface to cover the sensing part, wherein the sensing part is adapted to generate a sensing signal through an external force transmitted from the first colloid to the top surface.

Description

technical field [0001] The invention relates to a sensor, in particular to a force sensor. Background technique [0002] Micro-Electro-Mechanical System (MEMS) technology is a design based on the miniaturized electromechanical integrated structure. At present, the common MEMS technology is mainly used in the three major fields of Microsensors, Microactuators and Microstructures components. Microsensors can change the external environment (such as force, pressure, sound, speed, etc.) into electrical signals (such as voltage or current, etc.) to realize environmental sensing functions, such as force sensing, pressure sensing, sound sensing, acceleration sensing, etc. Because micro sensors can be manufactured using semiconductor process technology and can be integrated with integrated circuits, they have better competitiveness. Therefore, micro-electro-mechanical sensors and sensing devices using micro-electro-mechanical sensors are indeed the development trend of micro-elect...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G01L1/18G01L1/14G01L1/26
CPCG01L1/18G01L1/144G01L1/26
Inventor 童玺文蔡文彬吴名清
Owner CORETRONIC MEMS CORP
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