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Resin molding device and method for producing resin-molded product

A technology of resin forming and forming mold, which is applied in the field of resin forming devices

Active Publication Date: 2020-08-04
TOWA
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] In the past, in order to suppress the deformation of the platen, the operation of increasing the rigidity such as increasing the thickness of the platen has been carried out, resulting in the increase in size and weight of the resin molding equipment.

Method used

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  • Resin molding device and method for producing resin-molded product
  • Resin molding device and method for producing resin-molded product
  • Resin molding device and method for producing resin-molded product

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Embodiment Construction

[0056] Next, the present invention will be described in more detail with examples. However, the present invention is not limited by the following description.

[0057] As described above, the resin molding apparatus of the present invention includes: a molding die; a platen for mounting the molding die; a plurality of first transfer members provided on the molding die; and a plurality of second transfer members corresponding to The plurality of first transmission members are provided on the table, and the first transmission member and the second transmission member transmit the clamping force from the table to the forming die, and the first The contact surfaces of the first transmission member and the second transmission member are planar.

[0058] In the above-mentioned resin molding apparatus, since the contact surfaces between the plurality of transmission members provided on the molding die and the plurality of transmission members provided on the table are planar, even w...

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PUM

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Abstract

The invention provides a resin molding device and a method of producing a resin-molded product. The resin molding device maintains the flatness of a forming die regardless of the deformation of a platen, and is provided with: forming dies (2, 3); platens (41, 42) on which the forming dies (2, 3) are mounted; a plurality of first transmission members (5) provided to the molding dies (2, 3); and a plurality of second transmission members (6) which are provided on the platens (41, 42) in accordance with the plurality of first transmission members (5), wherein the first and second transmission members (5, 6) transmit the clamping force from the platens (41, 42) to the forming dies (2, 3), and the contact surfaces (5a, 6a) of the first and second transmission members (5, 6) are planar.

Description

technical field [0001] The present invention relates to a resin molding device and a method for manufacturing a resin molded product. Background technique [0002] In a resin molding apparatus utilizing compression molding, a platen on which a molding die is attached deforms during mold clamping. Then, the molding die attached to the table is also deformed by the deformation of the table. [0003] Conventionally, in order to suppress the deformation of the platen, operations such as increasing the thickness of the platen to increase rigidity have been performed, resulting in an increase in the size and weight of the resin molding apparatus. [0004] On the other hand, as shown in Patent Document 1, a resin sealing device is conceivable in which a movable platen on which a lower mold is placed is divided into a lower movable platen and an upper movable platen. Here, the lower movable platen is connected to the pressurizing mechanism, and the upper movable platen is provided...

Claims

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Application Information

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IPC IPC(8): B29C43/18B29C43/32B29C43/36
CPCB29C43/18B29C43/32B29C43/36B29C2043/182B29C37/00B29C2043/3283
Inventor 荒木宏祐谷口翔一西平贵则高井保昌法兼一贵
Owner TOWA