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Machining milling machine

A technology for milling machines and disc milling cutters, which is applied in the field of milling machines, and can solve the problems of large force, fracture, and thickness deviation at the left and right ends of the thin end of the workpiece on the inclined surface.

Active Publication Date: 2020-08-18
QINGDAO HUIJINTONG ELECTRIC POWER EQUIP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] Due to the deviation in the thickness of the left and right ends of the workpiece on the inclined surface, if the rotating cutter bar drives the disc milling cutter to perform lateral rotation and grooving on the inclined surface workpiece with a large difference in thickness between the left and right ends, it will be done from the thick end to the thin end. Horizontal grooving, so that when the disc milling cutter cuts to the thin end, it is easy to cause the thin end of the inclined workpiece to be broken due to excessive force due to the same rotating speed as the thick end

Method used

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  • Machining milling machine
  • Machining milling machine
  • Machining milling machine

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0026] For example figure 1 -example Figure 5 Shown:

[0027] The present invention provides a machining and milling machine, the structure of which includes a rotating tool bar 1, a lifting frame 2, a main shaft 3, a wafer milling cutter 4, a guide rail table 5, and a base 6. The rotating tool bar 1 is movably engaged with the main shaft 3, so The lifting frame 2 is welded with the base 6, the main shaft 3 is connected with the lifting frame 2, the guide rail table 5 is installed at the upper end position of the base 6, the operation table 7 and the guide rail table 5 are gap-fitted, and the wafer The milling cutter 4 and the rotary cutter bar 1 are an integrated structure; the disc milling cutter 4 includes a cutter a1, a connecting frame 43, a guide block 44, a telescopic rod 45, a sleeve frame 46, a clamping ball 47, and an engaging ring 48, so The inner side of the cutter a1 is in contact with the outer surface of the force receiving plate 41, the movable block 42 is m...

Embodiment 2

[0034] For example Image 6 -example Figure 8 Shown:

[0035] Wherein, the supporting surface b1 includes an edge connection block d1, a deformation surface d2, an elastic sheet d3, and a contact reduction block d4. The edge connection block d1 is embedded and connected with the deformation surface d2, and the elastic sheet d3 is installed on the deformation surface d2. Between the contact reduction block d4, the contact reduction block d4 is movably engaged with the deformation surface d2, and the contact reduction block d4 is provided with four, and the two are a group of uniform and symmetrical on the left side of the deformation surface d2. Distribution, through the reverse thrust generated by the object on the contact reduction block d4, the two adjacent contact reduction blocks d4 can be pushed to slide in the opposite direction along the deformation surface d2.

[0036] The edge connecting block d1 includes a plate surface d11, a guide groove d12, a separation plate ...

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PUM

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Abstract

The invention discloses a machining milling machine. The machining milling machine structurally comprises a rotating cutter bar, a lifting frame, a main shaft, a wafer milling cutter, a guide rail platform and a base. The rotating cutter bar and the main shaft are movably clamped and combined, the lifting frame and the base and welded with each other, and the main shaft and the lifting frame are connected with each other. The guide rail platform is installed at the upper end of the base, an operation platform and the guide rail platform are in clearance fit, and the wafer milling cutter and the rotating cutter bar are of an integrated structure. By means of the reverse thrust generated by an inclined plane workpiece to a cutter on the wafer milling cutter, the cutter can be drawn back fora certain distance in the reverse direction and then enters the interior of the workpiece in a cutting mode, and therefore the phenomenon that the wafer milling cutter directly generates the pressureto the thin end of the inclined plane workpiece can be avoided; and after grooving operation conducted by the wafer milling cutter on the inclined plane workpiece is accomplished, the wafer milling cutter is outwards pulled out, the plate surfaces on edge connection blocks can upwards slide along boosting blocks, and therefore separation plates can downwards swing along connecting points, the edgeconnection blocks can be pushed to continue to be inwards bent, and gaps can be generated between supporting surfaces and the inner wall of a groove.

Description

technical field [0001] The invention relates to the field of milling machines, in particular to a machining milling machine. Background technique [0002] The horizontal milling machine is mainly a machining milling machine with the main shaft parallel to the work. It can install a rotating tool holder through the main shaft, or even install a milling cutter such as a disc milling cutter on the rotating tool holder, and drive the rotating tool holder to rotate through the main shaft. The rotary cutter bar drives the disc milling cutter to perform grooving and other processing on the workpiece on the worktable, and when the spindle on the horizontal milling machine drives the rotary cutter bar to rotate, it is necessary to turn off the machine to adjust the data when changing the speed. To prevent the disc milling cutter on the rotating tool shank from breaking suddenly or reducing the situation when cutting the workpiece, based on the above description, the inventor found th...

Claims

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Application Information

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IPC IPC(8): B23C5/02B23C9/00B23C3/28B23C1/027B23Q11/00
CPCB23C1/027B23C3/28B23C5/02B23C9/00B23Q11/00B23Q11/0042
Inventor 陈雪莲
Owner QINGDAO HUIJINTONG ELECTRIC POWER EQUIP