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Semiconductor device

A technology of semiconductors and pillars, applied in the field of semiconductor devices including optical collimation layers, to achieve the effects of reducing collapse, good collimation performance, and maintaining collimation performance

Pending Publication Date: 2020-08-18
VANGUARD INTERNATIONAL SEMICONDUCTOR CORPORATION
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] However, existing optical collimators and methods of forming them are not satisfactory in all respects

Method used

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  • Semiconductor device
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Embodiment Construction

[0045] The following disclosure provides many different embodiments or examples for implementing different features of the present invention. The following disclosure describes specific examples of components and their arrangements for simplicity of illustration. Of course, these specific examples are not intended to be limiting. For example, if an embodiment of the present invention describes that a first characteristic component is formed on or above a second characteristic component, it means that it may include an embodiment in which the first characteristic component is in direct contact with the second characteristic component, and also Embodiments may be included in which additional features are formed between the first and second features such that the first and second features may not be in direct contact.

[0046] It should be understood that additional operational steps may be performed before, during or after the method, and in other embodiments of the method, som...

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PUM

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Abstract

The invention provides a semiconductor device. The semiconductor device comprises a substrate and a light collimation layer. The substrate has a plurality of pixels. The light collimation layer is arranged on the substrate and comprises a transparent material layer, a first shading layer, a second shading layer and a plurality of transparent cylinders. The transparent material layer covers the pixels. The first shading layer is arranged on the substrate, and the first shading layer is provided with a plurality of lead holes corresponding to the pixels. The second shading layer is arranged on the first shading layer. The transparent column body is arranged in the second shading layer. According to the invention, collapse of the transparent column body can be avoided or reduced, and the light collimation layer is enabled to maintain good collimation efficiency.

Description

technical field [0001] Embodiments of the present invention relate to a semiconductor device, and more particularly to a semiconductor device including a collimator layer. Background technique [0002] Semiconductor devices may be used in various applications. For example, a semiconductor device may be used as a biometric identification device (eg, at least a part of a fingerprint identification device, a facial recognition device, an iris identification device, etc.). Biometric devices can consist of a large number of optical components. For example, the above-mentioned optical element may include a collimator. [0003] A light collimator can be used to collimate light to reduce energy loss due to light divergence. Therefore, the optical collimator can be applied, for example, in a biometric identification device (eg, a fingerprint identification device) to increase its identification performance. [0004] However, existing light collimators and methods of forming them ...

Claims

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Application Information

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IPC IPC(8): G02B27/30G06K9/00
CPCG02B27/30G06V40/13
Inventor 罗宗仁廖志成刘士豪吕武羲罗明城钟伟纶林志威
Owner VANGUARD INTERNATIONAL SEMICONDUCTOR CORPORATION