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Semiconductor device and forming method thereof

A semiconductor and column technology, applied in semiconductor devices, radiation control devices, electric solid devices, etc., to reduce collapse and improve collimation efficiency

Pending Publication Date: 2021-03-09
VANGUARD INTERNATIONAL SEMICONDUCTOR CORPORATION
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0004] However, existing optical collimators and methods of forming them are not satisfactory in all respects

Method used

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  • Semiconductor device and forming method thereof
  • Semiconductor device and forming method thereof
  • Semiconductor device and forming method thereof

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Embodiment Construction

[0038] The following disclosure provides many different embodiments or examples for implementing different features of the present invention. The following disclosure describes specific examples of components and their arrangements for simplicity of illustration. Of course, these specific examples are not intended to be limiting. For example, if an embodiment of the present invention describes that a first characteristic component is formed on or above a second characteristic component, it means that it may include an embodiment in which the first characteristic component is in direct contact with the second characteristic component, and also Embodiments may be included in which additional features are formed between the first and second features such that the first and second features may not be in direct contact.

[0039] It should be understood that additional operational steps may be performed before, during or after the method, and in other embodiments of the method, som...

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Abstract

The invention provides a semiconductor device and a forming method thereof. The semiconductor device includes a substrate and a light collimating layer. The substrate has a plurality of pixels. The light collimating layer is arranged on the substrate. The light collimating layer comprises a shading layer arranged on the substrate, a plurality of transparent cylinders arranged in the shading layerand a plurality of optical micro lenses arranged on the pixels. According to the invention, the collimation efficiency of the light collimating layer can be improved, and the collapse of the transparent column body can be avoided or reduced.

Description

technical field [0001] Embodiments of the present invention relate to a semiconductor device, and more particularly to a semiconductor device including a collimator layer and a method for forming the same. Background technique [0002] Semiconductor devices may be used in various applications. For example, a semiconductor device can be used as a fingerprint recognition device (or at least a part of a fingerprint recognition device). A fingerprint recognition device can be composed of a large number of optical components. For example, the above-mentioned optical element may include a collimator. [0003] The function of the optical collimator is to collimate light to reduce energy loss caused by light divergence. For example, the light collimator can be applied in a fingerprint recognition device to increase the performance of the fingerprint recognition device. [0004] However, existing light collimators and methods of forming them are not satisfactory in all respects. ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L27/146G06K9/00
CPCH01L27/14627H01L27/14623H01L27/14685H01L27/14687G06V40/1318
Inventor 李新辉曾汉良林学荣李金政
Owner VANGUARD INTERNATIONAL SEMICONDUCTOR CORPORATION