Method and device for reducing interference of ground to PCB high-speed signal line

A high-speed signal and interference device technology, which is applied to the reduction of circuit devices, crosstalk/noise/electromagnetic interference (, printed circuit components, etc., can solve the problems of high component density, transmission quality impact, server system performance reduction, etc. Achieve the effect of improving transmission quality, improving space utilization, and ensuring performance

Active Publication Date: 2020-08-18
SHANDONG INSPUR SCI RES INST CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Due to the large area of ​​the main board of the server and the high density of components, the high-speed line number is easily affected by the inductance, MOS and power supply with high radiation (high radiation is called high-frequency electromagnetic radiation, which refers to radiation with a frequency above 3MHz) energy. The interference of the copper surface and dense power ground vias will seriously affect the transmission quality, which will greatly reduce the performance of the server system.

Method used

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  • Method and device for reducing interference of ground to PCB high-speed signal line

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Effect test

Embodiment 1

[0027] Reference attached figure 1 , this embodiment proposes a method for reducing ground interference to PCB high-speed signal lines. This method needs to add isolation bands on the PCB card. Five filter capacitors are arranged at intervals on the isolation bands. The isolation bands are used to separate other signals and The electromagnetic interference generated by the power supply GND is isolated from the reference GND of high-speed signals above 10G, and when connected to other reference GNDs, it passes through a filter capacitor to weaken the interference.

[0028] In this embodiment, the position of the isolation zone is between the high-speed signal above 10G and the power module with high radiation energy or the copper surface of the power supply with high current and the dense power ground via, which is used to connect the high-speed signal with other power supplies with high radiation energy Modules, high-current power supply copper planes or power supply planes th...

Embodiment 2

[0034] Reference attached figure 1 , On the basis of the first embodiment, a method for reducing the interference of the ground to the high-speed signal line of the PCB in this embodiment needs to add an isolation zone penetrating through all the GND layers on the PCB card.

[0035] Using the isolation zone, on the one hand, it can prevent the interference electromagnetic field from spreading outward and prevent the outside interference electromagnetic field from entering. At the same time, it can also isolate the interference electromagnetic waves from wires, components, etc., and use the filter capacitor at the output port to filter surface reflection and internal multiple Secondary reflection, which consumes most of the energy of interfering electromagnetic waves, has the function of weakening interference and protecting signals; on the other hand, it can greatly improve the space utilization of PCB boards, optimize other signals to better or add more Function, thus, the tr...

Embodiment 3

[0039] Reference attached figure 1 , this embodiment proposes a device for reducing ground interference to PCB high-speed signal lines. The structure of the device is an additional isolation zone on the PCB card and a filter capacitor arranged at intervals on the isolation zone. The isolation zone is used to separate other The electromagnetic interference generated by the signal and power supply GND is isolated from the high-speed signal reference GND above 10G, and is connected to other reference GNDs through a filter capacitor to weaken the interference.

[0040] In this embodiment, the position of the isolation zone is between the high-speed signal above 10G and the power module with high radiation energy or the copper surface of the power supply with high current and the dense power ground via, which is used to connect the high-speed signal with other power supplies with high radiation energy Modules, high-current power supply copper planes or power supply planes that coll...

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Abstract

The invention discloses a method for reducing interference of the ground to a PCB high-speed signal line, and relates to the technical field of PCB board cards. Aiming at the problem of poor transmission of high-speed signals of more than 10G, the technical scheme is adopted as follows: an isolation strip is additionally arranged on a PCB card, and the isolation strip is positioned between the high-speed signals of more than 10G and a power supply module with high radiation energy or a large-current power supply copper surface and a dense power supply ground via; at least two filter capacitorsare arranged on the isolation strip at intervals; and the isolation strip is used for isolating electromagnetic interference generated by other signals and a power supply GND outside a high-speed signal reference GND of more than 10G and weakening the interference through the filter capacitors when connected with other reference GND. The invention further discloses a device for reducing the interference of the ground to the PCB high-speed signal line. The device is essentially the isolation strip on the PCB board card and the filter capacitors arranged on the isolation strip at intervals, theinterference reducing device is the same as the interference reducing method, and the device can method can reduce interference and protect the signals, and the space utilization rate of the PCB board card is increased.

Description

technical field [0001] The invention relates to the technical field of PCB boards, in particular to a method and device for reducing ground interference to PCB high-speed signal lines. Background technique [0002] With the rapid development of the Internet, the performance of switches and servers continues to improve, and the operating speed of the system is also getting faster and faster. The operating speed of the chip transmission signal inside the system is also showing a rapid upward trend. The transmission quality of these high-speed signals is a key factor related to the performance of the entire server system. Due to the large area of ​​the main board of the server and the high density of components, the high-speed line number is easily affected by the inductance, MOS and power supply with high radiation (high radiation is called high-frequency electromagnetic radiation, which refers to radiation with a frequency above 3MHz) energy. The interference of the copper s...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K1/02
CPCH05K1/0231H05K1/0216H05K1/0236
Inventor 崔铭航刘强金长新
Owner SHANDONG INSPUR SCI RES INST CO LTD
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