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A cooling device for server gpu

A technology of a heat sink and a server, applied in the field of GPU, can solve the problems of low heat dissipation efficiency of the heat sink, low heat conduction efficiency of the heat sink, etc.

Active Publication Date: 2022-06-21
中天恒星(上海)科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The GPU will generate a lot of heat in the working book. The existing heat dissipation device dissipates heat through the radiator and the fan. The heat conduction efficiency of the radiator is relatively low, and the heat conduction rate is fixed. a less efficient

Method used

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  • A cooling device for server gpu
  • A cooling device for server gpu
  • A cooling device for server gpu

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Embodiment Construction

[0017] The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments.

[0018] refer to Figure 1-4 , a heat dissipation device for a server GPU, comprising a circuit board 1 on which the heat dissipation device is installed, the top outer wall of the circuit board 1 is fixed with a mounting frame 2 by bolts, and the inner wall of the mounting frame 2 is provided with a conical tube 3, and the inner walls on both sides of the conical tube 3 The fan 4 is fixed by bolts, the outer walls on both sides of the mounting frame 2 are provided with screw holes, and the inner walls of the two screw holes are screwed with fixing bolts 5, and the outer walls of the conical tube 3 are provided with equidistantly distributed...

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PUM

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Abstract

The invention discloses a heat dissipation device for a server GPU, which includes a circuit board for installing the heat dissipation device. The outer wall of the top of the circuit board is fixed with a mounting frame by bolts, and the inner wall of the mounting frame is provided with a conical tube. The two sides of the conical tube The inner wall is fixed with a fan by bolts, the outer walls on both sides of the mounting bracket are provided with screw holes, and the inner walls of the two screw holes are screwed with fixing bolts, and the outer walls of the conical tube are provided with equidistantly distributed cooling holes , The outer walls of both sides of the conical tube are provided with threaded holes, the two fixing bolts are screwed on the inner walls of the two threaded holes, and the inner wall of the conical tube is fixed with the first heat exchange tube by bolts. In the present invention, heat exchange tubes are arranged on the conical tube and the heat conduction block, and the cooling liquid in the two heat exchange tubes is driven to flow through the micropump, so that the heat on the GPU is conveniently and quickly exported, and then the heat is dissipated by the fan. The heat conduction block is provided with the cooperation between the telescopic rod and the spring, so that the heat conduction block is attached to the GPU.

Description

technical field [0001] The present invention relates to the technical field of GPU, in particular to a heat dissipation device for server GPU. Background technique [0002] The GPU reduces the dependence of the graphics card on the CPU, and performs part of the work of the original CPU, especially in 3D graphics processing. Texture compression and bump mapping, dual texture four-pixel 256-bit rendering engine, etc., and hardware T&L technology can be said to be the hallmark of GPU. [0003] The GPU will generate a lot of heat in the workbook. The existing heat sinks are used to dissipate heat through the radiator and the fan. The heat dissipation efficiency of the heat sink is relatively low, and the rate of heat conduction is fixed. A less efficient one. SUMMARY OF THE INVENTION [0004] Based on the technical problems existing in the background art, the present invention proposes a heat dissipation device for a server GPU. [0005] A heat dissipation device for a serv...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G06F1/20
CPCG06F1/20G06F2200/201
Inventor 黄永
Owner 中天恒星(上海)科技有限公司