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A flexible and stretchable micro-led mass transfer device and method

A transfer device and flexible technology, applied in the manufacturing of semiconductor devices, electrical components, semiconductor/solid-state devices, etc., can solve the problems of complex process flow, poor controllability, low transfer efficiency of Micro-LED mass transfer, etc., to simplify the process, Highly flexible and easy to operate

Active Publication Date: 2020-11-24
GUANGDONG UNIV OF TECH
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0005] The purpose of the present invention is to address the defects in the background technology and propose a flexible and stretchable Micro-LED mass transfer device and method to solve the problem of low efficiency, poor controllability and complicated process flow of the existing Micro-LED mass transfer In addition to ensuring accuracy and yield, the requirement for controllable dispersive chip spacing while being selectively released further meets the needs of low cost, easy operation, high efficiency, high flexibility, and simplified process.

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  • A flexible and stretchable micro-led mass transfer device and method
  • A flexible and stretchable micro-led mass transfer device and method
  • A flexible and stretchable micro-led mass transfer device and method

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Embodiment Construction

[0047] The technical solutions of the present invention will be further described below in conjunction with the accompanying drawings and through specific implementation methods.

[0048] In describing the present invention, it is to be understood that the terms "upper", "lower", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", The orientation or positional relationship indicated by "outside" is based on the orientation or positional relationship shown in the drawings, which is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the referred device or element must have a specific orientation, Constructed and operative in a particular orientation and therefore are not to be construed as limitations of the invention.

[0049] A flexible and stretchable Micro-LED mass transfer device of the present invention includes a transfer substrate and a receiving unit;

[0050] The transf...

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Abstract

The invention discloses a flexible and stretchable Micro-LED mass transfer device. The device comprises a transfer substrate and a bearing unit, wherein the transfer substrate comprises a flexible unit, a heat-sensitive adhesive, wafers and wafer bonding pads, the flexible unit is provided with an electric heating unit, the heat-sensitive adhesive is bonded on the surface of the electric heating unit, the plurality of wafers are bonded on the surface of the heat-sensitive adhesive, and the wafers are attached with the plurality of wafer bonding pads; the bearing unit comprises a receiving substrate and metal bumps distributed on the receiving substrate; and the metal bumps are in one-to-one correspondence with the wafer bonding pads. According to the invention, the problems of low mass transfer efficiency, poor controllability, complex process flow and the like of the existing Micro-LED are solved, while the accuracy and the yield are ensured, the requirement of controllable dispersionwafer spacing distance is met while selective release is realized, and the requirements of low cost, easy operation, high efficiency, high flexibility, simplified process and the like are further met.

Description

technical field [0001] The invention relates to the field of semiconductor optoelectronic technology, in particular to a flexible and stretchable Micro-LED mass transfer device and method. Background technique [0002] After researchers from Texas Tech University proposed the concept of Micro-LED at the beginning of this century, research institutions and manufacturers have successively increased their research on the development of this technology. Micro-LED and its derivative technologies refer to the miniaturization, thinning, and arraying of traditional LEDs, so that densely packed small sizes can be integrated on each chip with a size of 1 μm to 10 μm, and then selected and transferred in batches On the display substrate, electrodes and protective layers are made by physical deposition, and then packaged. Compared with traditional LED and OLED display technologies, it has the advantages of high luminous efficiency, high contrast, high color saturation, and long life, a...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L33/48H01L33/62H01L27/15H01L21/67
CPCH01L21/67144H01L27/156H01L33/486H01L33/62H01L2933/0033H01L2933/0066
Inventor 陈云丁树权陈新高健刘强贺云波
Owner GUANGDONG UNIV OF TECH