Image sensor and electronic device
A technology of image sensors and photosensitive holes, applied in the field of image sensors, can solve problems such as errors and data distortions, and achieve the effect of avoiding distortions or errors and solving distortions or errors
Pending Publication Date: 2020-09-01
WEIHAI HUALING OPTO ELECTRONICS CO LTD
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[0004] The main purpose of this application is to provide an image sensor and an electronic device to solve the problem of distortion or error in the data corresponding to the splicing of the contact image sensor in the prior art
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[0026] It should be pointed out that the following detailed description is exemplary and intended to provide further explanation to the present application. Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs.
[0027] It should be noted that the terminology used here is only for describing specific implementations, and is not intended to limit the exemplary implementations according to the present application. As used herein, unless the context clearly dictates otherwise, the singular is intended to include the plural, and it should also be understood that when the terms "comprising" and / or "comprising" are used in this specification, they mean There are features, steps, operations, means, components and / or combinations thereof.
[0028] It will be understood that when an element such as a layer, film, region, or substrate is referred to as ...
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The invention provides an image sensor and an electronic device, and the image sensor comprises a lens assembly which is formed by the splicing of a plurality of first lenses in a first direction; atleast one second lens, located on one side of the lens assembly, the projection area of the second lens on the lens assembly being a first projection area, and the splicing position of the at least two first lenses being located in the first projection area; a photosensitive chip assembly, comprising a plurality of first photosensitive chips, the first photosensitive chips being located on one side of the lens assembly, the first photosensitive chips being arranged in the first direction, and the first photosensitive chips being used for receiving light emitted by the lens assembly; at least one second photosensitive chip, located at one side of the second lens, and the second photosensitive chip being used for receiving light emitted by the second lens in a one-to-one correspondence manner; and a circuit board assembly, formed by sequentially arranging a plurality of circuit boards, and the first photosensitive chip and the second photosensitive chip being both located on the circuitboards. According to the image sensor, the problem of data distortion or errors corresponding to the splicing position of the image sensor in the prior art is solved.
Description
technical field [0001] The present application relates to the field of image sensors, in particular, to an image sensor and an electronic device. Background technique [0002] The length of the lens in the current CIS (Contact Image Sensor, referred to as contact image sensor) is limited, so when developing a longer CIS, because most of the purchased lenses are shorter and there is no longer lens, it is necessary to use lens splicing technology. Using the method of lens splicing to make longer lenses has a relatively low yield rate; even if it is a good product, the data corresponding to the splicing will be distorted or wrong. [0003] The above information disclosed in the Background section is only to enhance the understanding of the background of the technology described herein, therefore, the Background may contain certain information which is not formed in the country for those skilled in the art. known prior art. Contents of the invention [0004] The main purpose...
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IPC IPC(8): H04N1/031
CPCH04N1/0318
Inventor 曲传伟魏晓丽
Owner WEIHAI HUALING OPTO ELECTRONICS CO LTD