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CPU failure simulation method in radiation environment

A radiation environment and simulation method technology, applied in CAD circuit design, special data processing applications, instruments, etc., can solve the problems of limited number of test objects and few degradation data samples

Active Publication Date: 2020-09-22
UNIV OF ELECTRONICS SCI & TECH OF CHINA
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Problems solved by technology

[0004] According to the problems existing in the prior art, the present invention provides a process of using the bit error rate data as the failure process of the CPU board in the radiation environment, which solves the constraints of factors such as the test period and economic cost, and the entire evaluation system will Faced with a series of problems such as failure of power system components, limited number of test objects, and few samples of degradation data

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  • CPU failure simulation method in radiation environment
  • CPU failure simulation method in radiation environment
  • CPU failure simulation method in radiation environment

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Embodiment Construction

[0034] A kind of CPU board failure simulation model under the radiation environment of the present invention comprises the steps:

[0035] 1. For the typical circuit of driving SiP, according to its radiation reliability modeling simulation and calculation data needs, design a unique radiation reliability experiment system and scheme. The processing and manufacturing plan of the experimental equipment involved is completed through outsourcing, and the experiment execution or operation plan Send researchers to participate in the completion.

[0036] 2. Use the bit error rate as the experimental data to quantify the failure of the CPU board, and process and classify the data of each circuit board.

[0037] According to the composition circuit and function of the CPU board in the typical circuit of the driving SiP, a simulation model that can realize the function of the CPU board is designed by using simulik.

[0038] 3. Using the intercommunication between matlab and simulink, ...

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Abstract

The invention discloses a CPU failure simulation method in a radiation environment, and belongs to the technical field of reliability experiments, modeling simulation and calculation, which can solvea series of problems that the whole evaluation system is faced with incomplete failure of power supply system components, limited number of test objects, less degradation data samples and the like dueto restrictions of factors such as test period, economic cost and the like are solved. According to the method, the failure model of the CPU board in the driving SIP circuit in the radiation environment is simulated through simulink; the failure process is measured through the bit error rate, more feasibility and operability are provided for solving the problems of insufficient conditions, data shortage and the like during experiments under the severe radiation environment condition, and some ideas are provided for model simulation research of working and failure mechanisms of other circuit source parts under the special environment.

Description

technical field [0001] The invention belongs to the technical fields of reliability experiment, modeling simulation and calculation, and in particular relates to the simulation of the failure model of a CPU board under irradiation intensity in driving SiP radiation reliability simulation modeling. Background technique [0002] Electronic products are the key link to realize the automation and intelligence of equipment. As the direct source of power to ensure the operation of electronic products, the power system will lead to the paralysis of the whole machine and cause huge economic losses once it degrades and fails. At present, extensive research has been carried out on the degradation failure mode analysis of power systems at home and abroad, but in some special environments, especially in nuclear radiation environments, the degradation failure analysis and reliability assessment are very scarce. Therefore, this paper has carried out the degradation analysis and reliabilit...

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Application Information

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IPC IPC(8): G06F30/3308G06F115/10G06F119/02
CPCG06F30/3308G06F2115/10G06F2119/02Y02D10/00
Inventor 唐樟春梁堃李顺李征泰谢葭杨宗承李贵杰
Owner UNIV OF ELECTRONICS SCI & TECH OF CHINA