Wafer bearing device and semiconductor process equipment

Abstract

The invention discloses a wafer bearing device and semiconductor process equipment. The wafer bearing device comprises a tray supporting part, a plurality of clamping assemblies, a supporting frame and a tray for placing a wafer, wherein the tray supporting part is connected with the supporting frame, the multiple clamping assemblies are arranged in the circumferential direction of the tray at intervals, a tray clamping space is defined by the multiple clamping assemblies, the tray clamping space is used for containing the tray, the clamping assembly comprises an elastic piece and a guide part, an end, away from the tray, of the guide part is rotationally connected with the tray supporting part, the elastic piece is arranged between an end, close to the tray, of the guide part and the traysupporting part, under the condition that the tray is placed in the tray clamping space, the guide part rotates under the pressure effect of the tray, the elastic piece is compressed, and the tray iscentered while the tray is guided into the bottom of the tray clamping space. The wafer bearing device is advantaged in that a problem that in the transferring process of the tray, the mounting position of the tray in the wafer bearing device is likely to be changed, and consequently the film forming quality of the wafer is poor can be solved.

Description

technical field [0001] The invention relates to the technical field of semiconductor manufacturing, in particular to a wafer carrying device and semiconductor process equipment. Background technique [0002] With the rapid development of science and technology, LED lighting fixtures and LED displays are widely used in people's lives. LED is the main component of LED lamps or LED display screens. During the production process of LEDs, thin films need to be deposited on wafers to improve the brightness of LEDs. Wafers are usually coated with semiconductor process equipment. [0003] In the related art, semiconductor process equipment may include a wafer carrying device (generally called a flower basket, cassete), and the wafer carrying device is used for loading wafers. The wafer carrying device is loaded with multiple trays, and each tray can carry multiple wafers. The semiconductor process equipment can process multiple wafers at the same time by running the tray, thereby ...

AI Technical Summary

Problems solved by technology

[0005] The invention discloses a wafer carrying device and semiconductor process equipment to solve the problem that the installation position of the tray in the wafer carrying device is easily changed during the transfer process of the tray, resulting in poor film-forming quality of the wafer. question

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