Light sensing module packaging structure

Abstract

A light sensing module packaging structure comprises a substrate, a light emitting element, a light sensing wafer, a first light blocking layer and a second light blocking layer. The light emitting element and the light sensing chip are arranged on the substrate and are wrapped by a packaging colloid. The first light blocking layer is arranged between the light emitting element and the light sensing wafer. Therefore, light generated by the light-emitting element is prevented from being transmitted to the light sensing chip in a scattering or diffraction mode. The second light blocking layer isarranged on the upper surface of the packaging colloid in a printing mode and shields one part of the light sensing chip, so that light generated by the light emitting element is reflected by the object and then transmitted to the light sensing chip through the part which is not shielded by the second light blocking layer. Therefore, the light sensing module packaging structure provided by the invention can realize a thinning effect and improve the sensing sensitivity.

Description

technical field [0001] The invention relates to a packaging structure of a light sensing module, in particular to a packaging structure of a light sensing module capable of achieving a thinner effect. Background technique [0002] see figure 1 , figure 1 It is a schematic cross-sectional view of an existing light-sensing module packaging structure 10, which uses a molding process to wrap two encapsulants 11 on the light-emitting element 12 and the light-sensing chip 13, and then covers an upper cover 14 on the light-emitting element 12 and the light-sensing chip 13, and a spacer 15 is formed between them, and the light generated by the light-emitting element 12 is not transmitted to the light-sensing chip 13 through the spacer 15 through scattering or diffraction. However, in such a conventional structure, the upper cover 14 with the spacer 15 makes it difficult to effectively reduce the volume of the entire package structure 10 . [0003] see again figure 2 , figure ...

AI Technical Summary

Problems solved by technology

However, in such an existing structure, the stress applied during the secondary molding process is likely to affect the performance of the photo-sensing chip 23 and cause the stability of the photo-sensing chip 23 to decrease, and it is also impossible to make the entire packaging structure 20 is effectively reduced in size

[0004] From the above, it can be seen that the above two existing structures obviously cannot meet the current demand for thinner products

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