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A panel bonding device

A technology for laminating devices and panels, applied in the direction of organic semiconductor devices, semiconductor devices, electrical components, etc., can solve problems such as defective or damaged devices

Active Publication Date: 2022-06-07
江苏亚威艾欧斯激光科技有限公司
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] Organic light-emitting diode (OLED) is a curved screen used in mobile phones today. The curved screen needs to be attached to a flexible circuit board (FPC). Light-emitting diode (OLED) and flexible circuit board FPC bonding process has higher and higher requirements, usually organic light-emitting diode (organic light-emitting diode, OLED) and flexible circuit board FPC bonding use anisotropic conductive Anisotropic Conductive Film (ACF)) is used as an adhesive, and the organic light-emitting diode (OLED) is bonded to the flexible circuit board FPC by pressing the hot plate, but the method of pressing the hot plate is due to The heated hot plate is in contact with the device, which may easily cause defective or damaged devices

Method used

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Embodiment Construction

[0031] The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, but not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention.

[0032] Organic light-emitting diode (OLED) is a curved screen used in mobile phones today. The curved screen needs to be used with a flexible circuit board FPC. With the narrow edge trend of mobile phone screens, organic light-emitting diodes (organic The lamination process of light-emitting diode (OLED) and flexible circuit board FPC has higher and higher requirements. Usually, the lamination of organic light-emitting diode (OLED) and...

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Abstract

The invention discloses a panel bonding device, which comprises: a base; a column, one end of which is fixed on one side of the base; a horizontal frame, which is arranged at the end of the column away from the base; Installed on the base, the sliding direction of the workbench is consistent with the extension direction of the horizontal frame; the adhesive material bearing platform is slidably installed on the base; the pick-up part is installed on the horizontal frame One end, and allow the pick-up part to move in a direction perpendicular to the workbench; the laser emitting part, which is installed on the horizontal frame, and the emitting aspect of the laser emitting part faces the workbench; the force application part, It is installed on the horizontal frame and located on one side or both sides of the laser emitting part. The present invention aims to use the non-contact method of laser to counteract or eliminate the defective devices caused by heat.

Description

technical field [0001] The present invention relates to the technical field of display, in particular to the technical field of organic light-emitting diode (OLED) panels, and in particular to a panel laminating device. Background technique [0002] The organic light-emitting diode (OLED) display panel also has self-luminous organic electroluminescent diodes, no backlight, high contrast, thin thickness, wide viewing angle, fast response speed, and can be used for flexible panels. , Wide operating temperature range, simple structure and process are considered to be the next generation of flat-panel display emerging application technology. Organic light-emitting diodes (OLEDs) are self-luminous materials that do not require a backlight. At the same time, they have a wide viewing angle, uniform image quality, fast response speed, easy colorization, and can achieve light emission with a simple driving circuit. The process is simple, and it can be made into a flexible panel. ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L51/56H01L51/00H01L21/67H10K99/00
CPCH01L21/67H10K71/50H10K71/831H10K71/00
Inventor 朱鹏程凌步军袁明峰冯高俊赵有伟滕宇孙月飞吕金鹏冷志斌
Owner 江苏亚威艾欧斯激光科技有限公司
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