A method and device for analyzing wafer failure indicator, and computer readable medium

A wafer and index technology, applied in computer parts, computing, manufacturing computing systems, etc., can solve problems such as inability to quickly find process chambers

Pending Publication Date: 2020-10-23
全芯智造技术有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In the entire process flow of thousands of processes, since there are many production machines following this failure pattern, when performing process chamber commonality analysis to find the process chambers that cause low-yield events, it will be found that many processes The process chambers have commonality with the failed wafer, which makes it impossible to quickly find the real problematic process chamber

Method used

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  • A method and device for analyzing wafer failure indicator, and computer readable medium
  • A method and device for analyzing wafer failure indicator, and computer readable medium
  • A method and device for analyzing wafer failure indicator, and computer readable medium

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Embodiment Construction

[0036] Preferred embodiments of the present disclosure will be described in more detail below with reference to the accompanying drawings. Although preferred embodiments of the present disclosure are shown in the drawings, it should be understood that the present disclosure may be embodied in various forms and should not be limited by the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the disclosure to those skilled in the art.

[0037] As used herein, the term "comprise" and its variants mean open inclusion, ie "including but not limited to". The term "or" means "and / or" unless otherwise stated. The term "based on" means "based at least in part on". The terms "one example embodiment" and "one embodiment" mean "at least one example embodiment." The term "another embodiment" means "at least one further embodiment". The terms "first", "second", etc. may refer to di...

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PUM

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Abstract

Methods and device for analyzing failure metrics of a wafer and computer-readable media are described herein. The method for analyzing the failure index of the wafer described herein comprises the following steps: for a plurality of batches of wafers, respectively determining a fitting relationship between wafer randomization identifiers of a plurality of processes of a manufacturing process and the failure index representing a failure degree; determining a corresponding similarity value for each of the plurality of steps based on a comparison between a fitting relationship corresponding to awafer of a reference batch among the plurality of batches and a fitting relationship corresponding to a wafer of another batch among the plurality of batches; and determining a correlation between thewafer randomization identifier of at least one of the plurality of processes and a failure problem corresponding to the failure indicator based on the similarity values respectively corresponding tothe plurality of processes.

Description

technical field [0001] Embodiments of the present disclosure generally relate to the field of chip manufacturing technology, and more particularly, to methods and apparatuses and computer-readable media for analyzing failure indicators of wafers. Background technique [0002] The manufacturing process flow of a chip includes multiple processes. In each process, one or more production machines may be used. The production tool can be composed of at least one process chamber, and each process chamber is independent of each other to some extent. Each lot of wafers has an inherent wafer identifier (ID). For example, each lot of wafers may have a wafer ID (#1 to 25). [0003] Each batch of wafers enters the production machine and process chamber sequentially according to the wafer ID (#) in ascending order to carry out the corresponding process. A problem in one of the process chambers can result in a problem with one wafer in every two, three or four wafers in a batch. This ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G06F17/18G06Q10/06G06Q50/04G06K9/62
CPCG06F17/18G06Q10/06393G06Q50/04G06F18/22Y02P90/30
Inventor 不公告发明人
Owner 全芯智造技术有限公司
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