A method and device for analyzing wafer failure indicator, and computer readable medium

Abstract

Methods and device for analyzing failure metrics of a wafer and computer-readable media are described herein. The method for analyzing the failure index of the wafer described herein comprises the following steps: for a plurality of batches of wafers, respectively determining a fitting relationship between wafer randomization identifiers of a plurality of processes of a manufacturing process and the failure index representing a failure degree; determining a corresponding similarity value for each of the plurality of steps based on a comparison between a fitting relationship corresponding to awafer of a reference batch among the plurality of batches and a fitting relationship corresponding to a wafer of another batch among the plurality of batches; and determining a correlation between thewafer randomization identifier of at least one of the plurality of processes and a failure problem corresponding to the failure indicator based on the similarity values respectively corresponding tothe plurality of processes.

Description

technical field [0001] Embodiments of the present disclosure generally relate to the field of chip manufacturing technology, and more particularly, to methods and apparatuses and computer-readable media for analyzing failure indicators of wafers. Background technique [0002] The manufacturing process flow of a chip includes multiple processes. In each process, one or more production machines may be used. The production tool can be composed of at least one process chamber, and each process chamber is independent of each other to some extent. Each lot of wafers has an inherent wafer identifier (ID). For example, each lot of wafers may have a wafer ID (#1 to 25). [0003] Each batch of wafers enters the production machine and process chamber sequentially according to the wafer ID (#) in ascending order to carry out the corresponding process. A problem in one of the process chambers can result in a problem with one wafer in every two, three or four wafers in a batch. This ...

AI Technical Summary

Problems solved by technology

In the entire process flow of thousands of processes, since there are many production machines following this failure pattern, when performing process chamber commonality analysis to find the process chambers that cause low-yield events, it will be found that many processes The process chambers have commonality with the failed wafer, which makes it impossible to quickly find the real problematic process chamber

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